Power supply unit for aerosol generation device

ABSTRACT

A power supply unit for an aerosol generation device includes: a power supply configured to supply power to a heater configured to heat an aerosol source; a receptacle configured to receive power for charging the power supply from a plug connected to an external power supply; a charger configured to control charging of the power supply by power received by the receptacle; and a controller. The receptacle and the power supply are connected in parallel with the charger, and the charger is configured to supply power from the receptacle and the power supply to the controller via the charger.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromprior Japanese patent application No. 2020-118743, filed on Jul. 9,2020, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a power supply unit for an aerosolgeneration device.

BACKGROUND ART

Patent Literature 1 discloses a direct heating mode in which, in asmoking system including a primary device that supplies power to asecondary device and a secondary device that heats an aerosol-generationarticle, power is supplied from a power supply of the primary device toa load of the secondary device (a heating element that heats theaerosol-generation article).

Patent Literature 2 discloses a technology in which power from a chargeris supplied to a heating element provided in a tobacco cartridge.

Patent Literature 1: WO 2018/167817

Patent Literature 2: JP-T-2015-500647

However, in the related art described above, when a power supply (forexample, a secondary battery such as a lithium battery) provided in apower supply unit for an aerosol generation device is in anover-discharged state, power cannot be supplied to a controller of thepower supply unit even when the power supply unit is connected to anexternal power supply, and the controller may not be activated.Therefore, when the power supply is in the over-discharged state, evenwhen the power supply unit is connected to the external power supply, itis not possible to execute a function in which at least a part of thepower supply unit is controlled by the controller such as charging ofthe power supply, and the aerosol generation device may not be used.

SUMMARY OF INVENTION

The present invention provides a power supply unit for an aerosolgeneration device that can supply power from an external power supply toa controller of the power supply unit even when a power supply providedin the power supply unit for the aerosol generation device is in anover-discharged state.

According to an aspect of the present invention, there is provided apower supply unit for an aerosol generation device including: a powersupply configured to supply power to a heater configured to heat anaerosol source; a receptacle configured to receive power for chargingthe power supply from a plug connected to an external power supply; acharger configured to control charging of the power supply by powerreceived by the receptacle; and a controller, wherein the receptacle andthe power supply are connected in parallel with the charger, and whereinthe charger is configured to supply power from the receptacle and thepower supply to the controller via the charger.

According to the present invention, even when a power supply provided ina power supply unit for an aerosol generation device is in anover-discharged state, power from an external power supply can besupplied to a controller of the power supply unit.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of an aerosol inhaler according to anembodiment of the present invention.

FIG. 2 is an exploded perspective view of the aerosol inhaler of FIG. 1.

FIG. 3 is a cross-sectional view of the aerosol inhaler of FIG. 1.

FIG. 4 is a diagram showing a circuit configuration of a power supplyunit of the aerosol inhaler of FIG. 1.

FIG. 5 is a diagram showing systems provided in the power supply unit ofthe aerosol inhaler of FIG. 1.

FIG. 6 is a block diagram showing a configuration of an MCU of the powersupply unit of the aerosol inhaler of FIG. 1.

FIG. 7 is a diagram showing an example of an over-discharged state.

FIG. 8 is a diagram (part 1) showing an example of power supply control.

FIG. 9 is a diagram (part 2) showing an example of the power supplycontrol.

FIG. 10 is a diagram (part 3) showing an example of the power supplycontrol.

FIG. 11 is a diagram (part 4) showing an example of the power supplycontrol.

FIG. 12 is a diagram (part 5) showing an example of the power supplycontrol.

FIG. 13 is a schematic view showing main parts of the circuitconfiguration when a first surface of a circuit board of the aerosolinhaler of FIG. 1 is viewed from a right side.

FIG. 14 is a schematic view showing main parts of the circuitconfiguration when a ground layer of the circuit board of the aerosolinhaler of FIG. 1 is viewed from the right side.

FIG. 15 is a schematic view showing main parts of the circuitconfiguration when a power supply layer of the circuit board of theaerosol inhaler of FIG. 1 is viewed from the right side.

FIG. 16 is a schematic view showing main parts of the circuitconfiguration when a second surface of the circuit board of the aerosolinhaler of FIG. 1 is viewed from the right side.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a power supply unit for an aerosol generation deviceaccording to an embodiment of the present invention will be described.First, an aerosol inhaler, which is an example of the aerosol generationdevice including the power supply unit of the present embodiment, willbe described with reference to FIGS. 1 to 3.

(Aerosol Inhaler)

An aerosol inhaler 1 is an instrument for generating an aerosol to whicha flavor is added without burning and sucking the generated aerosol,preferably has a size that fits in a hand, and has a substantiallyrectangular parallelepiped shape. The aerosol inhaler 1 may have anovoid shape, an elliptical shape, or the like. In the followingdescription, regarding the aerosol inhaler having the substantiallyrectangular parallelepiped shape, three orthogonal directions will bereferred to as an upper-lower direction, a front-rear direction, and aleft-right direction in descending order of length. Further, in thefollowing description, for convenience, as shown in FIGS. 1 to 3, afront side, a rear side, a left side, a right side, an upper side, and alower side are defined, and the front side is shown as Fr, the rear sideis shown as Rr, the left side is shown as L, the right side is shown asR, the upper side is shown as U, and the lower side is shown as D.

As shown in FIGS. 1 to 3, the aerosol inhaler 1 includes a power supplyunit 10, a first cartridge 20, and a second cartridge 30. The firstcartridge 20 and the second cartridge 30 are attachable to anddetachable from the power supply unit 10. In other words, the firstcartridge 20 and the second cartridge 30 are replaceable.

(Power Supply Unit)

As shown in FIGS. 1 and 2, the power supply unit 10 houses varioussensors and the like such as a power supply 12, an internal holder 13, acircuit board 60, and an intake sensor 15 inside a power supply unitcase 11 having a substantially rectangular parallelepiped shape(hereinafter, also referred to as an inside of the case). The powersupply 12, the circuit board 60 (including an MCU 50, a dischargingterminal 41, a charging terminal 43, and the like, which will bedescribed later), and the like are collectively housed in the powersupply unit case 11, so that carrying by a user can be facilitated anduser convenience can be improved.

The power supply unit case 11 is configured with a first case 11A and asecond case 11B that are attachable and detachable in the left-rightdirection (thickness direction), and the first case 11A and the secondcase 11B are assembled in the left-right direction (thicknessdirection), so that a front surface, a rear surface, a left surface, aright surface, and a lower surface of the power supply unit 10 areformed. An upper surface of the power supply unit 10 is formed by adisplay 16.

A mouthpiece 17 is provided in the upper surface of the power supplyunit 10 in front of the display 16. In the mouthpiece 17, a suction port17 a protrudes further upward than the display 16.

An inclined surface inclined downward toward the rear side is providedbetween the upper surface and the rear surface of the power supply unit10. An operation unit 18 that can be operated by the user is provided onthe inclined surface. The operation unit 18 is configured with abutton-type switch, a touch panel, and the like, and is used whenactivating or interrupting the MCU 50 and various sensors by reflectinga use intention of the user, or the like.

On a lower surface of the power supply unit 10, the charging terminal 43that can be electrically connected to an external power supply (notshown) that can charge the power supply 12 is provided. The chargingterminal 43 is, for example, a receptacle into which a mating plug (notshown) can be inserted. As the charging terminal 43, a receptacle intowhich various USB terminals (plugs) or the like can be inserted can beused. As an example, in the present embodiment, the charging terminal 43is a USB Type-C shaped receptacle. Accordingly, it is possible tofacilitate charging of the power supply unit 10 (that is, the aerosolinhaler 1) at various locations (places) and secure an opportunitycapable of charging the power supply unit 10. The charging terminal 43is an example of a receptacle in the present invention.

The charging terminal 43 may include, for example, a power receptioncoil, and may be configured to be capable of receiving power transmittedfrom the external power supply in a non-contact manner. A wireless powertransfer method in this case may be an electromagnetic induction type, amagnetic resonance type, or a combination of the electromagneticinduction type and the magnetic resonance type. As another example, thecharging terminal 43 can be connected to various USB terminals or thelike and may include the power reception coil described above.

The internal holder 13 includes a rear wall 13 r that extends along therear surface of the power supply unit 10, a central wall 13 c that isprovided at a central portion in the front-rear direction inside thecase and extends parallel to the rear wall 13 r, an upper wall 13 u thatextends along the display 16 and couples the rear wall 13 r to thecentral wall 13 c, a partition wall 13 d that is orthogonal to the rearwall 13 r, the central wall 13 c, and the upper wall 13 u and divides aspace partitioned and formed by the rear wall 13 r, the central wall 13c, and the upper wall 13 u into a left side space and a right sidespace, and a cartridge holding portion 13 a coupled to the central wall13 c and positioned in front of the central wall 13 c and above thelower surface of the power supply unit 10.

The power supply 12 is disposed in the left side space of the internalholder 13. The power supply 12 is a rechargeable secondary battery, anelectric double-layer capacitor, or the like, and is preferably alithium-ion secondary battery. An electrolyte of the power supply 12 maybe one of or a combination of a gel-like electrolyte, an electrolyticsolution, a solid electrolyte, and an ionic liquid.

The L-shaped circuit board 60 is disposed in a space formed by a rightside space of the internal holder 13 and a lower side space formedbetween the cartridge holding portion 13 a and the lower surface of thepower supply unit 10. The circuit board 60 is configured by stacking aplurality of layers (four layers in the present embodiment) of boards,and electronic components (elements) such as the micro controller unit(MCU) 50 and a charging IC 55, which will be described later, aremounted on the circuit board 60.

Although details will be described later with reference to FIG. 5 andthe like, the MCU 50 is a control device (a controller) that isconnected to various sensor devices such as the intake sensor 15 thatdetects a puff (intake) operation, the operation unit 18, a notificationunit 45, a memory 19 that stores number of times of puff operations, anenergization time to the load 21, or the like, and the like, and thatperforms various controls of the aerosol inhaler 1, and is an example ofa controller in the present invention. Specifically, the MCU 50 ismainly configured with a processor, and further includes a storagemedium such as a random access memory (RAM) required for an operation ofthe processor and a read only memory (ROM) that stores various pieces ofinformation. The processor in the present description is, for example,an electric circuit in which circuit elements such as semiconductorelements are combined. Some of the elements (for example, the intakesensor 15 and the memory 19) connected to the MCU 50 in FIG. 5 may beprovided inside the MCU 50 as a function of the MCU 50 itself

The charging IC 55 is an integrated circuit (IC) that controls chargingof the power supply 12 by power input from the charging terminal 43 andthat supplies power of the power supply 12 to the electronic componentsand the like of the circuit board 60, and is an example of a charger inthe present invention.

A cylindrical cartridge holder 14 that holds the first cartridge 20 isdisposed at the cartridge holding portion 13 a.

A through hole 13 b, which receives the discharging terminal 41 (seeFIG. 3) provided so as to protrude from the circuit board 60 toward thefirst cartridge 20, is provided in a lower end portion of the cartridgeholding portion 13 a. The discharging terminal 41 is a connector thatelectrically connects the load 21 provided in the first cartridge 20.Further, the discharging terminal 41 is a connector that removably (oreasily removably) connects the load 21, and is configured with, forexample, a pin or the like in which a spring is built. The dischargingterminal 41 is an example of a connector in the present invention.

The through hole 13 b is larger than the discharging terminal 41, and isconfigured such that air flows into an inside of the first cartridge 20via a gap formed between the through hole 13 b and the dischargingterminal 41.

The intake sensor 15 that detects a puff operation is provided on anouter peripheral surface 14 a of the cartridge holder 14 at a positionfacing the circuit board 60. The intake sensor 15 may be configured witha condenser microphone, a pressure sensor, or the like.

Further, the cartridge holder 14 is provided with a hole portion 14 bthat is long in the upper-lower direction and through which a remainingamount of the aerosol source 22 stored inside the first cartridge 20 canbe visually checked, and is configured such that the user can visuallycheck the remaining amount of the aerosol source 22 stored inside thefirst cartridge 20 through the hole portion 14 b of the first cartridge20 from a remaining amount check window 11 w that has light-transmissiveproperties and is provided in the power supply unit case 11.

As shown in FIG. 3, the mouthpiece 17 is detachably fixed to an upperend portion of the cartridge holder 14. The second cartridge 30 isdetachably fixed to the mouthpiece 17. The mouthpiece 17 includes acartridge housing portion 17 b that houses a part of the secondcartridge 30, and a communication path 17 c that allows the firstcartridge 20 and the cartridge housing portion 17 b to communicate witheach other.

The power supply unit case 11 is provided with air intake ports 11 ithat take in outside air inside. The air intake port 11 i is providedin, for example, the remaining amount check window 11 w.

(First Cartridge)

As shown in FIG. 3, the first cartridge 20 includes, inside acylindrical cartridge case 27, a reservoir 23 that stores the aerosolsource 22, an electrical load 21 that atomizes the aerosol source 22, awick 24 that draws the aerosol source from the reservoir 23 to the load21, and an aerosol flow path 25 through which an aerosol generated byatomizing the aerosol source 22 flows toward the second cartridge 30.

The reservoir 23 is partitioned and formed so as to surround a peripheryof the aerosol flow path 25, and stores the aerosol source 22. Thereservoir 23 may house a porous body such as a resin web or cotton, andthe aerosol source 22 may be impregnated with the porous body. Thereservoir 23 may store only the aerosol source 22 without housing theporous body on the resin web or the cotton. The aerosol source 22contains a liquid such as glycerin, propylene glycol, or water.

The wick 24 is a liquid holding member that draws the aerosol source 22from the reservoir 23 to the load 21 by using a capillary phenomenon.The wick 24 is made of, for example, glass fiber, porous ceramic, or thelike.

The load 21 is a heat generation element (that is, a heater) that heatsthe aerosol source 22 without burning by power supplied from the powersupply 12 via the discharging terminal 41, and is configured with, forexample, an electric heating wire (a coil) wound at a predeterminedpitch. The load 21 heats the aerosol source 22 to atomize the aerosolsource 22. As the load 21, a heat generation resistor, a ceramic heater,an induction heating type heater, or the like can be used. The load 21is an example of a heater in the present invention.

The aerosol flow path 25 is provided on a downstream side of the load 21and on a center line of the first cartridge 20.

(Second Cartridge)

The second cartridge 30 stores a flavor source 31. The second cartridge30 is detachably housed in the cartridge housing portion 17 b providedin the mouthpiece 17.

The second cartridge 30 adds a flavor to an aerosol by passing theaerosol generated by atomizing the aerosol source 22 by the load 21through the flavor source 31. As a raw material piece that constitutesthe flavor source 31, chopped tobacco or a molded body obtained bymolding a tobacco raw material into a granular shape can be used. Theflavor source 31 may be formed of a plant other than the tobacco (forexample, mint, Chinese herb or herb). A fragrance such as menthol may beadded to the flavor source 31.

The aerosol inhaler 1 can generate (that is, produce) an aerosol towhich a flavor is added by the aerosol source 22, the flavor source 31,and the load 21. That is, the aerosol source 22 and the flavor source 31constitute an aerosol generation source that generates the aerosol towhich the flavor is added.

The configuration of the aerosol generation source used for the aerosolinhaler 1 may be a configuration in which the aerosol source 22 and theflavor source 31 are integrally formed, a configuration in which theflavor source 31 is omitted and a substance that can be contained in theflavor source 31 is added to the aerosol source 22, a configuration inwhich a medicine or the like instead of the flavor source 31 is added tothe aerosol source 22, or the like, in addition to the configuration inwhich the aerosol source 22 and the flavor source 31 are formedseparately.

In the aerosol inhaler 1 configured as described above, as indicated byan arrow A in FIG. 3, air that flows in from the air intake ports 11 iprovided in the power supply unit case 11 passes through a vicinity ofthe load 21 of the first cartridge 20 via the gap formed between thethrough hole 13 b and the discharging terminal 41. The load 21 atomizesthe aerosol source 22 drawn from the reservoir 23 by the wick 24. Theaerosol generated by atomization flows through the aerosol flow path 25together with the air that flows in from the intake ports, and issupplied to the second cartridge 30 via the communication path 17 c. Theaerosol supplied to the second cartridge 30 is flavored by passingthrough the flavor source 31, and is supplied to a suction port 32.

The aerosol inhaler 1 is provided with the notification unit 45 thatnotifies various pieces of information (see FIG. 5). The notificationunit 45 may be configured with a light-emitting element, a vibrationelement, or a sound output element. Further, the notification unit 45may be a combination of two or more elements among the light-emittingelement, the vibration element, and the sound output element. Thenotification unit 45 may be provided in any one of the power supply unit10, the first cartridge 20, and the second cartridge 30, but ispreferably provided in the power supply unit 10 that is not a consumableitem.

In the present embodiment, an organic light emitting diode (OLED) panel46 and a vibrator 47 are provided as the notification unit 45. When anOLED of the OLED panel 46 emits light, various pieces of information onthe aerosol inhaler 1 are notified to the user via the display 16.Further, the vibrator 47 vibrates, so that the user is notified of thevarious pieces of information on the aerosol inhaler 1 via the powersupply unit case 11. The notification unit 45 may be provided with onlyone of the OLED panel 46 and the vibrator 47, or may be provided withanother light-emitting element or the like. Further, informationnotified by the OLED panel 46 and information notified by the vibrator47 may be different or the same.

(Electric Circuit)

Next, an electric circuit of the power supply unit 10 will be describedwith reference to FIG. 4.

As shown in FIG. 4, the power supply unit 10 includes, as maincomponents, the power supply 12, the charging terminal 43, the MCU 50,the charging IC 55, a protection IC 61, an LDO regulator (indicated by“LDO” in FIG. 4) 62, a first DC/DC converter (indicated by “first DC/DC”in FIG. 4) 63, a second DC/DC converter (indicated by “second DC/DC” inFIG. 4) 64, a display driver 65, the intake sensor 15, the OLED panel46, and the vibrator 47.

The charging terminal 43 is the receptacle into which the mating plugcan be inserted as described above, and includes a plurality of pins(terminals) electrically connected to a pin of the inserted plug.Specifically, the charging terminal 43 includes an A1 pin (indicated by“A1” in FIG. 4), an A4 pin (indicated by “A4” in FIG. 4), an A5 pin(indicated by “A5” in FIG. 4), an A6 pin (indicated by “A6” in FIG. 4),an A7 pin (indicated by “A7” in FIG. 4), an A8 pin (indicated by “A8” inFIG. 4), an A9 pin (indicated by “A9” in FIG. 4), an A12 pin (indicatedby “A12” in FIG. 4), a B1 pin (indicated by “B1” in FIG. 4), a B4 pin(indicated by “B4” in FIG. 4), a B5 pin (indicated by “B5” in FIG. 4), aB6 pin (indicated by “B6” in FIG. 4), a B7 pin (indicated by “B7” inFIG. 4), a B8 pin (indicated by “B8” in FIG. 4), a B9 pin (indicated by“B9” in FIG. 4), and a B12 pin (indicated by “B12” in FIG. 4).

The A1 pin, the A4 pin, the A5 pin, the A6 pin, the A7 pin, the A8 pin,the A9 pin, the A12 pin, the B1 pin, the B4 pin, the B5 pin, the B6 pin,the B7 pin, the B8 pin, the B9 pin, and the B12 pin are arranged so asto be point-symmetrical, with a center of a fitting surface with a plugof the charging terminal 43 as a point of symmetry. Accordingly, theplug can be inserted into the charging terminal 43 regardless of anupper-lower direction of the plug, and user convenience is improved.

It should be noted that, in the present embodiment, only main pins amongpins provided in the charging terminal 43 are described. Further, in thepresent embodiment, the charging terminal 43 is provided with the A8 pinand the B8 pin, but as will be described later, these pins are not usedand may be omitted.

The protection IC 61 is an IC having a function of converting a voltageinput via the charging terminal 43 into a predetermined voltage asnecessary and outputting the converted voltage. Specifically, theprotection IC 61 converts the input voltage into a voltage included in arange from a minimum value to a maximum value of a recommended inputvoltage of the charging IC 55. Accordingly, even when a high voltagethat exceeds the maximum value of the recommended input voltage of thecharging IC 55 is input via the charging terminal 43, the protection IC61 can protect the charging IC 55 from the high voltage.

As an example, in the present embodiment, the recommended input voltageof the charging IC 55 has a minimum value of 4.35 [V] and a maximumvalue of 6.4 [V]. Therefore, the protection IC 61 converts the inputvoltage into 5.5±0.2 [V], and outputs the converted voltage to thecharging IC 55. Accordingly, the protection IC 61 can supply anappropriate voltage to the charging IC 55. Further, when theabove-described high voltage is input via the charging terminal 43, theprotection IC 61 may protect the charging IC 55 by opening a circuitthat connects an input terminal (denoted by IN in FIG. 4) and an outputterminal (denoted by OUT in FIG. 4) of the protection IC 61. Inaddition, the protection IC 61 may also have various protectionfunctions (for example, an overcurrent detection function and anovervoltage detection function) for protecting the electric circuit ofthe power supply unit 10.

It is preferable that the protection IC 61 is connected between thecharging terminal 43 and the charging IC 55, that is, is electricallyprovided between the charging terminal 43 and the charging IC 55. Theprotection IC 61 is connected between the charging terminal 43 and thecharging IC 55, so that the power supply 12 can be discharged via thecharging IC 55 without passing through the protection IC 61, and powerloss due to passing through the protection IC 61 can be reduced.

The protection IC 61 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the protection IC61. Specifically, the protection IC 61 includes an IN pin (indicated by“IN” in FIG. 4), a VSS pin (indicated by “VSS” in FIG. 4), a GND pin(indicated by “GND” in FIG. 4), an OUT pin (indicated by “OUT” in FIG.4), a VBAT pin (indicated by “VBAT” in FIG. 4), and a CE pin (indicatedby “CE” in FIG. 4).

In the protection IC 61, the IN pin is a pin to which power suppliedfrom the charging terminal 43 is input. The VSS pin is a pin to whichpower for operating the protection IC 61 is input. The GND pin is agrounded pin. The OUT pin is a pin that outputs power to the charging IC55. The VBAT pin is a pin for the protection IC 61 to detect a state ofthe power supply 12. The CE pin is a pin for switching the protectionfunction of the protection IC 61 on/off. A connection relationship ofthese pins will be described later. It should be noted that, in thepresent embodiment, only main pins among pins provided in the protectionIC 61 are described.

The charging IC 55 is an IC having a function of controlling charging tothe power supply 12 and a function of supplying the power of the powersupply 12 to the LDO regulator 62, the first DC/DC converter 63, thesecond DC/DC converter 64, and the like. For example, when supplying thepower of the power supply 12, the charging IC 55 outputs a standardsystem voltage corresponding to an output of the power supply 12 at thattime to the LDO regulator 62, the first DC/DC converter 63, the secondDC/DC converter 64, and the like. Here, the standard system voltage is avoltage higher than a low-voltage system voltage described later andlower than a first high-voltage system voltage and a second high-voltagesystem voltage. The standard system voltage is, for example, an outputvoltage of the power supply 12 itself, and can be a voltage of about 3to 4 [V].

The charging IC 55 also has a power-path function of supplying powerinput via the charging terminal 43 to the LDO regulator 62, the firstDC/DC converter 63, the second DC/DC converter 64, and the like.

When the power-path function is used, even when the power supply 12 isbeing charged, power input via the charging terminal 43 can be suppliedto a system of the power supply unit 10, such as the LDO regulator 62,the first DC/DC converter 63, and the second DC/DC converter 64.Therefore, when the system of the power supply unit 10 is used whilecharging the power supply 12, the system of the power supply unit 10 canbe used while reducing a burden on the power supply 12 (that is,preventing deterioration of the power supply 12). At the same time, itis also possible to improve a charging speed of the power supply 12 andshorten a charging time.

Details will be described later with reference to FIGS. 7 to 11 and thelike, but if the power-path function is used, even when the power supply12 is in an over-discharged state, it is possible to activate the MCU 50by using power that is from the external power supply and input via thecharging terminal 43, and to recover the system of the power supply unit10. Here, the over-discharged state is, for example, a state where thepower supply 12 cannot supply power for the MCU 50 to function (that is,operate). In other words, when the power supply 12 is in theover-discharged state, the MCU 50 cannot operate only with power of thepower supply 12 and is in a stopped state.

The charging IC 55 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the charging IC 55.Specifically, the charging IC 55 includes an IN pin (indicated by “IN”in FIG. 4), a BAT_1 pin (indicated by “BAT 1” in FIG. 4), a BAT_2 pin(indicated by “BAT 2” in FIG. 4), an ISET pin (indicated by “ISET” inFIG. 4), a TS pin (indicated by “TS” in FIG. 4), an OUT_1 pin (indicatedby “OUT 1” in FIG. 4), an OUT_2 pin (indicated by “OUT 2” in FIG. 4), anILIM pin (indicated by “ILIM” in FIG. 4), a CHG pin (indicated by “CHG”in FIG. 4), and a CE pin (indicated by “CE” in FIG. 4). Although detailswill be described later, the BAT_1 pin, the BAT_2 pin, the OUT_1 pin,and the OUT_2 pin of the charging IC 55 are examples of output terminalsin the present invention.

It should be noted that, in the present embodiment, only main pins amongpins provided in the charging IC 55 are described. Further, in thepresent embodiment, the charging IC 55 is provided with the BAT_1 pinand the BAT_2 pin, but the BAT_1 pin and the BAT_2 pin may be combinedas one pin. Similarly, in the present embodiment, the charging IC 55 isprovided with the OUT_1 pin and the OUT_2 pin, but the OUT_1 pin and theOUT_2 pin may be combined as one pin.

The LDO regulator 62 is an IC having a function of generating alow-voltage system voltage from an input standard system voltage andoutputting the generated low-voltage system voltage. Here, thelow-voltage system voltage is a voltage lower than the standard systemvoltage as described above, and is, for example, a voltage suitable foroperating the MCU 50, the intake sensor 15, and the like. An example ofthe low-voltage system voltage is 2.5 [V]. The LDO regulator 62 is anexample of a regulator in the present invention.

The LDO regulator 62 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the LDO regulator62. Specifically, the LDO regulator 62 includes an IN pin (indicated by“IN” in FIG. 4), a GND pin (indicated by “GND” in FIG. 4), an OUT pin(indicated by “OUT” in FIG. 4), and an EN pin (indicated by “EN” in FIG.4). Although details will be described later, the EN pin of the LDOregulator 62 is an example of an activation terminal in the presentinvention. It should be noted that, in the present embodiment, only mainpins among pins provided in the LDO regulator 62 are described.

The MCU 50 operates using the input low-voltage system voltage as apower supply, and performs various controls of the aerosol inhaler 1.For example, the MCU 50 can control heating of the load 21 bycontrolling on/off of a switch SW4 described later and provided in theelectric circuit of the power supply unit 10 and an operation of thefirst DC/DC converter 63. Further, the MCU 50 can control a display ofthe display 16 by controlling an operation of the display driver 65.Furthermore, the MCU 50 can control vibration of the vibrator 47 bycontrolling on/off of a switch SW3 described later and provided in theelectric circuit of the power supply unit 10.

The MCU 50 includes a plurality of pins (terminals) for electricallyconnecting an inside and an outside of the MCU 50. Specifically, the MCU50 includes a VDD pin (indicated by “VDD” in FIG. 4), a VDD_USB pin(indicated by “VDD_USB” in FIG. 4), a VSS pin (indicated by “VSS” inFIG. 4), a PC1 pin (indicated by “PC1” in FIG. 4), a PA8 pin (indicatedby “PA8” in FIG. 4), a PB3 pin (indicated by “PB3” in FIG. 4), a PB15pin (indicated by “PB15” in FIG. 4), a PB4 pin (indicated by “PB4” inFIG. 4), a PC6 pin (indicated by “PC6” in FIG. 4), a PA0 pin (indicatedby “PA0” in FIG. 4), a PC5 pin (indicated by “PC5” in FIG. 4), a PA11pin (indicated by “PA11” in FIG. 4), a PA12 pin (indicated by “PA12” inFIG. 4), a PC12 pin (indicated by “PC12” in FIG. 4), a PB8 pin(indicated by “PB8” in FIG. 4), a PB9 pin (indicated by “PB9” in FIG.4), and a PB14 pin (indicated by “PB14” in FIG. 4).

It should be noted that, in the present embodiment, only main pins amongpins provided in the MCU 50 are described. Further, in the presentembodiment, the MCU 50 is provided with the VDD pin and the VDD_USB pin,but the VDD pin and the VDD_USB pin may be combined as one pin.

The intake sensor 15 is a sensor device that detects a puff operation asdescribed above, and is, for example, a sensor device configured tooutput a signal indicating a value of a change in a pressure (aninternal pressure) in the power supply unit 10 caused by suction of theuser through the suction port 32 as a detection result as will bedescribed later.

The intake sensor 15 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the intake sensor15. Specifically, the intake sensor 15 includes a VCC pin (indicated by“VCC” in FIG. 4), a GND pin (indicated by “GND” in FIG. 4), and an OUTpin (indicated by “OUT” in FIG. 4). It should be noted that, in thepresent embodiment, only main pins among pins provided in the intakesensor 15 are described.

The vibrator 47 is provided in a state of being connected to a positiveelectrode side terminal 47 a provided on a power supply line 60E and toa negative electrode side terminal 47 b provided on a ground line 60N tobe described later, and includes a motor (not shown) that rotates arotation shaft according to a voltage input via the positive electrodeside terminal 47 a and the negative electrode side terminal 47 b, and aneccentric weight (not shown) attached to the rotation shaft of themotor. When a voltage (for example, a low-voltage system voltage) isinput to the vibrator 47 via the positive electrode side terminal 47 aand the negative electrode side terminal 47 b, the motor and theeccentric weight are rotated to generate vibration.

In the present description, the term “positive electrode side” means ahigher potential side than the “negative electrode side”. That is, inthe following description, the term “positive electrode side” may beread as “high potential side”. Further, in the present description, theterm “negative electrode side” means a lower potential side than the“positive electrode side”. That is, in the following description, theterm “negative electrode side” may be read as “low potential side”.

The vibrator 47 is provided in a state of being attached to the powersupply unit 10. The positive electrode side terminal 47 a and thenegative electrode side terminal 47 b are connected to a terminal of thevibrator 47 by, for example, soldering. That is, the positive electrodeside terminal 47 a and the negative electrode side terminal 47 b areconnectors that connect the vibrator 47 such that the vibrator 47 isunremovable (or is difficult to be removed). The positive electrode sideterminal 47 a and the negative electrode side terminal 47 b are examplesof a first connector in the present invention. The term unremovable (ordifficult to be removed) refers to a mode in which the power supply unit10 cannot be removed as long as the power supply unit 10 is assumed tobe used.

The first DC/DC converter 63 is an IC having a function of generating afirst high-voltage system voltage from an input standard system voltageand outputting the generated first high-voltage system voltage. Here,the first high-voltage system voltage is a voltage higher than thestandard system voltage as described above. That is, the first DC/DCconverter 63 steps up the input standard system voltage to the firsthigh-voltage system voltage and outputs the first high-voltage systemvoltage. The first high-voltage system voltage is, for example, avoltage suitable for heating the load 21, and is 4.2 [V] as an example.

The first DC/DC converter 63 includes a plurality of pins (terminals)for electrically connecting an inside and an outside of the first DC/DCconverter 63. Specifically, the first DC/DC converter 63 includes a VINpin (indicated by “VIN” in FIG. 4), an SW pin (indicated by “SW” in FIG.4), a GND pin (indicated by “GND” in FIG. 4), a VOUT pin (indicated by“VOUT” in FIG. 4), a MODE pin (indicated by “MODE” in FIG. 4), and an ENpin (indicated by “EN” in FIG. 4). It should be noted that, in thepresent embodiment, only main pins among pins provided in the firstDC/DC converter 63 are described.

The second DC/DC converter 64 is an IC having a function of generating asecond high-voltage system voltage from the input standard systemvoltage and outputting the generated second high-voltage system voltage.Here, the second high-voltage system voltage is a voltage higher thanthe standard system voltage as described above. That is, the secondDC/DC converter 64 steps up the input standard system voltage to thesecond high-voltage system voltage and outputs the second high-voltagesystem voltage. Further, the second high-voltage system voltage is avoltage even higher than the first high-voltage system voltage, and is,for example, a voltage suitable for operating the OLED panel 46. Anexample of the second high-voltage system voltage is 15 [V].

The second DC/DC converter 64 includes a plurality of pins (terminals)for electrically connecting an inside and an outside of the second DC/DCconverter 64. Specifically, the second DC/DC converter 64 includes a VINpin (indicated by “VIN” in FIG. 4), an SW pin (indicated by “SW” in FIG.4), a GND pin (indicated by “GND” in FIG. 4), a VOUT pin (indicated by“VOUT” in FIG. 4), and an EN pin (indicated by “EN” in FIG. 4). Itshould be noted that, in the present embodiment, only main pins amongpins provided in the second DC/DC converter 64 are described.

The display driver 65 is an IC having a function of operating by usingan input low-voltage system voltage as a power supply, and supplying asecond high-voltage system voltage to the OLED panel 46 whilecontrolling the OLED panel 46 so as to control a display of the display16.

The display driver 65 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the display driver65. Specifically, the display driver 65 includes a VDD pin (indicated by“VDD” in FIG. 4), a VSS pin (indicated by “VSS” in FIG. 4), a VCC_C pin(indicated by “VCC_C” in FIG. 4), an SDA pin (indicated by “SDA” in FIG.4), an SCL pin (indicated by “SCL” in FIG. 4), and an IXS pin (indicatedby “IXS” in FIG. 4). It should be noted that, in the present embodiment,only main pins among pins provided in the display driver 65 aredescribed.

The components of the power supply unit 10 described above areelectrically connected to one another by a lead wire or the likeprovided on the circuit board 60 of the power supply unit 10.Hereinafter, electrical connection of the components of the power supplyunit 10 will be described in detail.

The A1 pin, the A12 pin, the B1 pin, and the B12 pin of the chargingterminal 43 are ground pins. The A1 pin and the B12 pin are connected inparallel and grounded by the ground line 60N. Similarly, the A12 pin andthe B1 pin are also connected in parallel and grounded by the groundline 60N. In FIG. 4, the ground line 60N (that is, a line having apotential of substantially 0 [V]) is indicated by a thick solid line.

The A4 pin, the A9 pin, the B4 pin, and the B9 pin of the chargingterminal 43 are pins that receive an input of power from a plug of anexternal power supply inserted into the charging terminal 43 to thepower supply unit 10. For example, when the plug is inserted into thecharging terminal 43, predetermined USB bus power is supplied to thepower supply unit 10 from the inserted plug via the A4 pin and the B9pin, or the A9 pin and the B4 pin. Further, power corresponding to USBpower delivery (USB PD) may be supplied to the power supply unit 10 fromthe plug of the external power supply inserted into the chargingterminal 43.

Specifically, the A4 pin and the B9 pin are connected in parallel andconnected to the IN pin of the protection IC 61 via the power supplyline 60A. The IN pin of the protection IC 61 is a power supply pin ofthe protection IC 61 on a positive electrode side. Further, the A9 pinand the B4 pin are also connected in parallel, and connected to the INpin of the protection IC 61 via the power supply line 60A.

The power supply line 60A is connected to the ground line 60N via avariable resistor (a nonlinear resistance element) VR1. Here, thevariable resistor is an element that includes two terminals(electrodes), has a relatively high electric resistance value when avoltage between the two terminals is lower than a predetermined variableresistor voltage (for example, 27 [V] in a case of the presentembodiment), and has a property in which the electric resistance valuerapidly decreases when the voltage between the two terminals is equal toor higher than the variable resistor voltage.

Specifically, one end of the variable resistor VR1 is connected to anode N11 provided in the power supply line 60A, and the other end of thevariable resistor VR1 is connected to the ground line 60N. Here, thenode N11 is provided in the power supply line 60A on a protection IC 61side with respect to a node connected to the A4 pin and the B9 pin and anode connected to the A9 pin and the B4 pin. Therefore, for example,even when static electricity is generated in the A4 pin, the A9 pin, theB4 pin, or the B9 pin due to friction between the charging terminal 43and the plug when the plug is inserted into the charging terminal 43,the static electricity can be released to the ground line 60N via thevariable resistor VR1 to protect the protection IC 61.

The power supply line 60A is connected to the ground line 60N via acapacitor CD1 that functions as a decoupling capacitor (also referred toas a bypass capacitor or a smoothing capacitor). Accordingly, a voltageinput to the protection IC 61 via the power supply line 60A can bestabilized. Specifically, one end of the capacitor CD1 is connected to anode N12 provided in the power supply line 60A, and the other end of thecapacitor CD1 is connected to the ground line 60N. Here, the node N12 isprovided in the power supply line 60A on the protection IC 61 side withrespect to the node N11. Therefore, even when static electricity isgenerated at the A4 pin, the A9 pin, the B4 pin, or the B9 pin, thevariable resistor VR1 can protect the capacitor CD1 from the staticelectricity. That is, in the power supply line 60A, by providing thenode N12 on the protection IC 61 side with respect to the node N11, itis possible to achieve both protection of the protection IC 61 fromovervoltage and a stable operation of the protection IC 61.

The A6 pin, the A7 pin, the B6 pin, and the B7 pin of the chargingterminal 43 are pins used for input and output of a signal forcommunication between the power supply unit 10 and an externalapparatus. In the present embodiment, serial communication in whichsignals are transmitted differentially by two signal lines Dp (alsoreferred to as D+) and Dn (also referred to as D−) is used forcommunication between the power supply unit 10 and the externalapparatus.

The A6 pin and the B6 pin are pins corresponding to a signal line on aDp side. The A6 pin and the B6 pin are connected in parallel, and areconnected to the PA12 pin of the MCU 50 via a resistor R1. The resistorR1 is an element that is configured with a resistance element, atransistor, or the like and has a predetermined electric resistancevalue. Further, the PA12 pin of the MCU 50 is a pin used for input andoutput of a signal of the MCU 50. Therefore, a signal on the Dp sidefrom the external apparatus can be input to the MCU 50 via the A6 pin orthe B6 pin. Further, the signal on the Dp side from the MCU 50 can beoutput to the external apparatus via the A6 pin or the B6 pin.

The A6 pin and the B6 pin are also connected to the ground line 60N viaa variable resistor VR2. Therefore, for example, even when staticelectricity is generated in the A6 pin and the B6 pin due to thefriction between the charging terminal 43 and the plug when the plug isinserted into the charging terminal 43, the static electricity can bereleased to the ground line 60N via the variable resistor VR2 to protectthe MCU 50. Further, since the resistor R1 is provided between the pinsA6 and B6 and the MCU 50, the resistor R1 can also prevent input of ahigh voltage to the MCU 50 and protect the MCU 50.

The A7 pin and the B7 pin are pins corresponding to a signal line on aDn side. The A7 pin and the B7 pin are connected in parallel andconnected to the PA11 pin of the MCU 50 via a resistor R2. The resistorR2 is an element that is configured with a resistance element, atransistor, or the like and has a predetermined electric resistancevalue. Further, the PA11 pin of the MCU 50 is a pin used for input andoutput of a signal of the MCU 50. Therefore, a signal on the Dn sidefrom the external apparatus can be input to the MCU 50 via the A7 pin orthe B7 pin. Further, a signal on the Dn side from the MCU 50 can beoutput to the external apparatus via the A7 pin or the B7 pin.

The A7 pin and the B7 pin are also connected to the ground line 60N viaa variable resistor VR3. Therefore, for example, even when staticelectricity is generated in the A7 pin or the B7 pin due to the frictionbetween the charging terminal 43 and the plug when the plug is insertedinto the charging terminal 43, the static electricity can be released tothe ground line 60N via the variable resistor VR3 to protect the MCU 50.Further, since the resistor R2 is provided between the pins A7 and B7and the MCU 50, the resistor R2 can also prevent an input of a highvoltage to the MCU 50 and protect the MCU 50.

The A5 pin and the B5 pin of the charging terminal 43 are pins used todetect an upper-lower direction of the plug inserted into the chargingterminal 43. For example, the A5 pin is a pin corresponding to a signalline of a first configuration channel (CC) signal (a CC1 signal), andthe B5 pin is a pin corresponding to a signal line of a second CC signal(a CC2 signal). The A5 pin is connected to the ground line 60N via theresistor R3, and the B5 pin is connected to the ground line 60N via aresistor R4.

The A8 pin and the B8 pin of the charging terminal 43 are not connectedto the electric circuit of the power supply unit 10. Therefore, the A8pin and the B8 pin are not used and may also be omitted.

As described above, the IN pin of the protection IC 61 is the powersupply pin of the protection IC 61 on the positive electrode side and isconnected to the power supply line 60A. The VS S pin of the protectionIC 61 is a power supply pin of the protection IC 61 on a negativeelectrode side and is connected to the ground line 60N. Further, the GNDpin of the protection IC 61 is a ground pin of the protection IC 61 andis connected to the ground line 60N.

Accordingly, when the plug of the external power supply is inserted intothe charging terminal 43, power (for example, USB bus power) is suppliedto the protection IC 61 via the power supply line 60A.

The OUT pin of the protection IC 61 is a pin from which a voltage inputto the IN pin of the protection IC 61 is output as it is or a voltage(for example, 5.5±0.2 [V]) converted by the protection IC 61 is output,and is connected to the IN pin of the charging IC 55 via the powersupply line 60B. The IN pin of the charging IC 55 is a power supply pinof the charging IC 55 on a positive electrode side. Accordingly, anappropriate voltage converted by the protection IC 61 is supplied to thecharging IC 55.

The power supply line 60B is connected to the ground line 60N via acapacitor CD2 that functions as a decoupling capacitor. Accordingly, avoltage input to the charging IC 55 via the power supply line 60B can bestabilized.

The VBAT pin of the protection IC 61 is a pin used by the protection IC61 for detecting presence or absence of connection of the power supply12, and is connected to a positive electrode side terminal 12 a of thepower supply 12 via a resistor R5. The resistor R5 is an element that isconfigured with a resistance element, a transistor, or the like and hasa predetermined electric resistance value. The protection IC 61 candetect that the power supply 12 is connected based on a voltage input tothe VBAT pin.

The CE pin of the protection IC 61 is a pin for turning on/off anoperation (various functions) of the protection IC 61. Specifically, theprotection IC 61 operates when a low-level voltage is input to the CEpin, and stops the operation when a high-level voltage is input to theCE pin. In the present embodiment, the CE pin of the protection IC 61 isconnected to the ground line 60N so that the low-level voltage is alwaysinput. Therefore, the protection IC 61 always operates during a supplyof power, and performs conversion to a predetermined voltage,overcurrent detection, overvoltage detection, and the like.

Instead of the protection IC 61 in the present embodiment, a protectionIC that operates when a high-level voltage is input to a CE pin andstops the operation when a low-level voltage is input to the CE pin maybe used. However, in this case, it should be noted that the CE pin ofthe protection IC needs to be connected to the power supply line 60B orthe power supply line 60A instead of the ground line 60N.

As described above, the IN pin of the charging IC 55 is the power supplypin of the charging IC 55 on the positive electrode side, and isconnected to the power supply line 60B. Further, the charging IC 55 isconnected to the ground line 60N by, for example, a power supply pin ona negative electrode side (not shown). Accordingly, a voltage outputfrom the protection IC 61 is supplied to the charging IC 55 via thepower supply line 60B.

The BAT_1 pin and the BAT_2 pin of the charging IC 55 are pins used totransmit and receive power between the charging IC 55 and the powersupply 12, and are connected to the positive electrode side terminal 12a of the power supply 12 via a power supply line 60C.

A negative electrode side terminal 12 b of the power supply 12 isconnected to the ground line 60N.

Specifically, the BAT_1 pin and the BAT_2 pin are connected in parallel,connected to the positive electrode side terminal 12 a, and connected tothe ground line 60N via a capacitor CD3. When the power supply 12 isdischarged, electric charge is accumulated in the capacitor CD3, and avoltage output from the power supply 12 is input to the BAT_1 pin andthe BAT_2 pin. Further, when the power supply 12 is charged, a voltagefor charging the power supply 12 is output from the BAT_1 pin and theBAT_2 pin, and is applied to the positive electrode side terminal 12 aof the power supply 12 via the power supply line 60C.

The power supply line 60C is connected to the ground line 60N via acapacitor CD4 that functions as a decoupling capacitor. Accordingly, avoltage input to the power supply 12 via the power supply line 60C canbe stabilized.

The ISET pin of the charging IC 55 is a pin for setting a value of acurrent output from the charging IC 55 to the power supply 12. In thepresent embodiment, the ISET pin is connected to the ground line 60N viaa resistor R6. Here, the resistor R6 is an element that is configuredwith a resistance element, a transistor, or the like and has apredetermined electric resistance value.

The charging IC 55 outputs, to the power supply 12, a current having acurrent value corresponding to an electric resistance value of theresistor R6 connected to the ISET pin.

The TS pin of the charging IC 55 is a pin to which a voltage valueapplied to a resistor connected to the TS pin is input and that is usedto detect an electric resistance value and a temperature of the resistorconnected to the TS pin based on the voltage value. In the presentembodiment, the TS pin is connected to the ground line 60N via aresistor R7. Here, the resistor R7 is an element that is configured witha resistance element, a transistor, or the like and has a predeterminedelectric resistance value. Therefore, the charging IC 55 can detect anelectric resistance value and a temperature of the resistor R7 based ona voltage value applied to the resistor R7.

The CHG pin of the charging IC 55 is a pin that outputs information on acharging state of the power supply 12 (hereinafter, also referred to ascharging state information), such as during charging, during a chargingstop, and charging completion, and information on a remaining capacityof the power supply 12 (hereinafter, also referred to as remainingcapacity information). The CHG pin of the charging IC 55 is connected tothe PB15 pin of the MCU 50. The PB15 pin of the MCU 50 is a pin used toinput a signal of the MCU 50. Therefore, the charging IC 55 can notifythe MCU 50 of the charging state, the remaining capacity, and the likeof the power supply 12 by outputting the charging state information andthe remaining capacity information from the CHG pin to the MCU 50.

The OUT_1 pin and the OUT_2 pin of the charging IC 55 are pins fromwhich the standard system voltage is output, and are connected to the INpin of the LDO regulator 62, the VIN pin of the first DC/DC converter63, and the VIN pin of the second DC/DC converter 64 via a power supplyline 60D. The IN pin of the LDO regulator 62 is a power supply pin ofthe LDO regulator 62 on a positive electrode side. Further, the VIN pinof the first DC/DC converter 63 is a power supply pin of the first DC/DCconverter 63 on a positive electrode side. Then, the VIN pin of thesecond DC/DC converter 64 is a power supply pin of the second DC/DCconverter 64 on a positive electrode side.

Specifically, the OUT_1 pin is connected to the ground line 60N and tothe OUT_2 pin via a capacitor CD5 that functions as a decouplingcapacitor. Then, the OUT_1 pin and the OUT_2 pin are connected to theground line 60N via a capacitor CD6 that functions as a decouplingcapacitor, and are connected to the IN pin of the LDO regulator 62, theVIN pin of the first DC/DC converter 63, and the VIN pin of the secondDC/DC converter 64. Accordingly, the charging IC 55 can supply a stablestandard system voltage to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64.

In the present embodiment, a capacitor CD7 that functions as adecoupling capacitor is also provided immediately before the first DC/DCconverter 63 of the power supply line 60D. Accordingly, a stablestandard system voltage can be supplied to the first DC/DC converter 63,and a power supply from the first DC/DC converter 63 to the load 21 canbe stabilized.

The ILIM pin of the charging IC 55 is a pin for setting an upper limitof a value of a current output from the charging IC 55 to the LDOregulator 62, the first DC/DC converter 63, and the second DC/DCconverter 64. In the present embodiment, the ILIM pin is connected tothe ground line 60N via the resistor R7. Here, the resistor R7 is theelement that is configured with the resistance element, the transistor,or the like and has a predetermined electric resistance value.

The charging IC 55 outputs, to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64, a current whose upperlimit is a current value corresponding to the electric resistance valueof the resistor R7 connected to the ILIM pin. More specifically, thecharging IC 55 outputs the current having the current valuecorresponding to the electric resistance value of the resistor R6connected to the ISET pin from the OUT_1 pin and the OUT_2 pin, andstops outputting the current from the OUT_1 pin and the OUT_2 pin whenthe current value reaches a current value corresponding to the electricresistance value of the resistor R7 connected to the ILIM pin. That is,a manufacturer of the aerosol inhaler 1 can set an upper limit value ofthe current output from the charging IC 55 to the LDO regulator 62, thefirst DC/DC converter 63, and the second DC/DC converter 64 by theelectric resistance value of the resistor R7 connected to the ILIM pin.

The CE pin of the charging IC 55 is a pin for turning on/off charging ofthe power supply 12. Specifically, when a low-level voltage is input tothe CE pin while power is supplied from the external power supply viathe charging terminal 43, the charging IC 55 charges the power supply 12with power supplied from the external power supply. In other words, thecharging IC 55 does not charge the power supply 12 when a high-levelvoltage is input to the CE pin even when power is supplied from theexternal power supply via the charging terminal 43.

In the present embodiment, the CE pin of the charging IC 55 is connectedto the PB14 pin of the MCU 50. Therefore, the MCU 50 can turn on/off thecharging of the power supply 12 by the charging IC 55 by a voltagesignal output from the PB14 pin.

The charging IC 55 is configured to be capable of outputting, from theOUT_1 pin and the OUT_2 pin, power obtained by combining power that doesnot charge the power supply 12 among power from the external powersupply received by the IN pin and power from the power supply 12received by the BAT_1 pin and the BAT_2 pin when power is supplied fromthe external power supply via the charging terminal 43. That is, thecharging IC 55 includes the OUT_1 pin and the OUT_2 pin that are outputterminals capable of outputting the power that is received by thecharging terminal 43 and does not charge the power supply 12 and thepower supplied from the power supply 12 in combination.

Accordingly, since the charging IC 55 can output the power that does notcharge the power supply 12 among the power from the external powersupply and the power from the power supply 12 in combination, it ispossible to supply power to the system of the power supply unit 10 whilepreventing a decrease in the remaining capacity of the power supply 12.Therefore, it is possible to use various functions of the power supplyunit 10 while preventing the decrease in the remaining capacity of thepower supply 12. The OUT_1 pin and the OUT_2 pin are examples of anoutput terminal in the present invention.

The above-described power-path function is used, so that the charging IC55 can also output the power for charging the power supply 12 from theBAT_1 pin and the BAT_2 pin to the power supply 12, and output the powerfor not charging the power supply 12 from the OUT_1 pin and the OUT_2pin to the system of the power supply unit 10, among power from theexternal power supply received via the charging terminal 43. That is,the charging IC 55 can also distribute and supply power received fromthe external power supply to the power supply 12 and the system of thepower supply unit 10. Accordingly, it is possible to cause the system ofthe power supply unit 10 to function while charging the power supply 12with the power received from the external power supply.

An LED circuit C1 is provided by branching from the power supply line60D. The LED circuit C1 is configured by connecting a resistor R8, anLED 70, and a switch SW1 in series. Here, the resistor R8 is an elementthat is configured with a resistance element, a transistor, or the likeand has a predetermined electric resistance value. The resistor R8 ismainly used to limit a voltage applied to the LED 70 and/or a currentsupplied to the LED 70. The LED 70 is a light-emitting portion providedat a position corresponding to the remaining amount check window 11 winside the power supply unit 10, and configured to illuminate an outsideof the power supply unit 10 from an inside of the power supply unit 10via the remaining amount check window 11 w. When the LED 70 emits light,visibility of a remaining amount of the first cartridge 20(specifically, a remaining amount of the aerosol source 22 stored in thefirst cartridge 20) via the remaining amount check window 11 w isimproved. The switch SW1 is, for example, a switch configured with aMOSFET or the like.

One end of the LED circuit C1 on a resistor R8 side, that is, one end ofthe resistor R8 is connected to a node N21 provided in the power supplyline 60D. The other end of the resistor R8 constitutes a connector 70 aand is connected to a terminal of the LED 70 on an anode side. One endof the switch SW1 constitutes a connector 70 b and is connected to aterminal of the LED 70 on a cathode side. The other end of the LEDcircuit C1 on a switch SW1 side, that is, the other end of the switchSW1 is connected to the ground line 60N.

The switch SW1 is also connected to the MCU 50 as will be describedlater, is turned on in response to an on command of the MCU 50, and isturned off in response to an off command of the MCU 50. The LED circuitC1 is in a conductive state when the switch SW1 is turned on. Then, theLED 70 emits light when the LED circuit C1 is in a conductive state, andguides the user to a remaining capacity of the first cartridge 20 in aneasy-to-understand manner.

A voltage system for causing the LED 70 to function (that is, operate)by the standard system voltage (that is, the output voltage of the powersupply 12 or the voltage input via the charging terminal 43) ishereinafter also referred to as a direct-coupling system. Thedirect-coupling system will be described later again with reference toFIG. 5 and the like.

As described above, the IN pin of the LDO regulator 62 is the powersupply pin of the LDO regulator 62 on the positive electrode side, andis connected to the power supply line 60D. The GND pin of the LDOregulator 62 is a ground pin of the LDO regulator 62 and is connected tothe ground line 60N. Accordingly, the standard system voltage outputfrom the charging IC 55 is supplied to the LDO regulator 62 via thepower supply line 60D.

The OUT pin of the LDO regulator 62 is a pin that outputs a low-voltagesystem voltage generated by the LDO regulator 62, and is connected tothe VDD pin and the VDD_USB pin of the MCU 50, the VCC pin of the intakesensor 15, the VDD pin and the IXS pin of the display driver 65, and thepositive electrode side terminal 47 a connected to the vibrator 47 viathe power supply line 60E. The VDD pin and the VDD_USB pin of the MCU 50are power supply pins of the MCU 50 on a positive electrode side.Further, the VCC pin of the intake sensor 15 is a power supply pin ofthe intake sensor 15 on a positive electrode side. Then, the VDD pin ofthe display driver 65 is a power supply pin of the display driver 65 ona positive electrode side. Accordingly, the LDO regulator 62 can supplythe low-voltage system voltage to the MCU 50, the intake sensor 15, thedisplay driver 65, and the vibrator 47.

A voltage system for causing the MCU 50, the intake sensor 15, thevibrator 47, and the like to function (that is, operate) by thelow-voltage system voltage obtained by stepping down the standard systemvoltage (that is, the output voltage of the power supply 12 or thevoltage input via the charging terminal 43) is hereinafter also referredto as a step-down system. The step-down system will be described lateragain with reference to FIG. 5 and the like.

The EN pin of the LDO regulator 62 is a pin for turning on/off anoperation (a function) of the LDO regulator 62. Specifically, the LDOregulator 62 operates when a high-level voltage is input to the EN pin,and stops the operation when the high-level voltage is not input to theEN pin.

In the present embodiment, the EN pin of the LDO regulator 62 isconnected to the power supply line 60D and also connected to the groundline 60N via a capacitor CD8.

Therefore, when the standard system voltage is output from the chargingIC 55, electric charge is accumulated in the capacitor CD8, thehigh-level voltage is input to the EN pin of the LDO regulator 62, theLDO regulator 62 operates, and the low-voltage system voltage is outputfrom the LDO regulator 62.

That is, in the power supply unit 10, the capacitor CD8 connected to theEN pin of the LDO regulator 62 can be charged by power from the chargingIC 55, and a high-level signal can be input to the EN pin of the LDOregulator 62. Accordingly, even when the LDO regulator 62 and the MCU 50are in a stopped state due to power shortage of the power supply 12, theLDO regulator 62 can be reactivated by power from the external powersupply, and the MCU 50 can also be reactivated by power from the LDOregulator 62. The EN pin of the LDO regulator 62 is an example of anactivation terminal in the present invention.

As described above, the VDD pin and the VDD_USB pin of the MCU 50 arepower supply pins of the MCU 50 on the positive electrode side, and areconnected to the power supply line 60E. The VSS pin of the MCU 50 is apower supply pin of the MCU 50 on a negative electrode side and isconnected to the ground line 60N. Accordingly, a low-voltage systemvoltage output from the LDO regulator 62 is supplied to the MCU 50 viathe power supply line 60E. The VDD pin and the VDD_USB pin may becombined as one pin.

A thermistor circuit C2 is provided by branching from the power supplyline 60E. The thermistor circuit C2 is configured by connecting a switchSW2, a resistor R9, and a thermistor TH in series. One end of thethermistor circuit C2 on a switch SW2 side is connected to a node N31provided in the power supply line 60E. Further, the other end of thethermistor circuit C2 on a thermistor TH side is connected to the groundline 60N.

Here, the switch SW2 is a switch configured with, for example, a MOSFETor the like. The switch SW2 is connected to the MCU 50 as will bedescribed later, is turned on in response to the on command of the MCU50, and is turned off in response to the off command of the MCU 50. Thethermistor circuit C2 is in a conductive state when the switch SW2 isturned on.

The resistor R9 is an element that is configured with a resistanceelement, a transistor, or the like and has a predetermined electricresistance value. The thermistor TH includes an element having negativetemperature coefficient (NTC) characteristics or positive temperaturecoefficient (PTC) characteristics, that is, an element having acorrelation between an electric resistance value and a temperature, andthe like. The thermistor TH is disposed in the vicinity of the powersupply 12 in a state where a temperature of the power supply 12 can bedetected.

The PC1 pin of the MCU 50 is connected to a node N32 provided betweenthe resistor R9 and the thermistor TH in the thermistor circuit C2. Whenthe thermistor circuit C2 is in the conductive state (that is, when theswitch SW2 is turned on), a voltage divided by the resistor R9 and thethermistor TH is input to the PC1 pin. The MCU 50 can detect atemperature of the thermistor TH, that is, the temperature of the powersupply 12, based on a voltage value input to the PC1 pin.

The PA8 pin of the MCU 50 is a pin that is connected to the switch SW2and outputs an on command to turn on the switch SW2 and an off commandto turn off the switch SW2. The MCU 50 can turn on the switch SW2 to putthe thermistor circuit C2 in the conductive state by outputting the oncommand from the PA8 pin. Further, the MCU 50 can turn off the switchSW2 to put the thermistor circuit C2 in a non-conductive state byoutputting the off command from the PA8 pin. As a specific example, whenthe switch SW2 is a switch configured with a MOSFET, the PA8 pin of theMCU 50 is connected to a gate terminal of the MOSFET. Then, the MCU 50can control on/off of the switch SW2 by controlling a gate voltage (thatis, an output from the PA8 pin) applied to the gate terminal.

In the power supply line 60E, the switch SW3 is provided in front of thepositive electrode side terminal 47 a. Here, the switch SW3 is a switchconfigured with, for example, a MOSFET or the like. The switch SW3 isconnected to the MCU 50, is turned on in response to the on command ofthe MCU 50, and is turned off in response to the off command of the MCU50.

Specifically, the PC6 pin of the MCU 50 is a pin that is connected tothe switch SW3 and outputs an on command to turn on the switch SW3 andan off command to turn off the switch SW3. When the on command is outputfrom the PC6 pin, the MCU 50 can turn on the switch SW3, supply power tothe vibrator 47 by the power supply line 60E, and vibrate the vibrator47. Further, when the off command is output from the PC6 pin, the MCU 50can turn off the switch SW3, and stop the supply of power to thevibrator 47 by the power supply line 60E (that is, the vibration of thevibrator 47). As a specific example, when the switch SW3 is a switchconfigured with a MOSFET, the PC6 pin of the MCU 50 is connected to agate terminal of the MOSFET. Then, the MCU 50 can control on/off of theswitch SW3 by controlling a gate voltage (that is, an output from thePC6 pin) applied to the gate terminal.

A Zener diode D is connected to the power supply line 60E. Here, theZener diode is a diode that includes two terminals (electrodes) on ananode side and a cathode side, and in which a current rapidly flows fromthe cathode side to the anode side when a voltage of a terminal on theanode side exceeds a predetermined Zener voltage (also referred to as abreakdown voltage, for example, in a case of the present embodiment, avoltage lower than the variable resistor voltage described above).

Specifically, one end of the Zener diode D on the anode side isconnected to the ground line 60N, and the other end of the Zener diode Don the cathode side is connected to a node N41 provided in the powersupply line 60E. Here, the node N41 is provided between the switch SW3and the positive electrode side terminal 47 a in the power supply line60E. Accordingly, even when a counter-electromotive force having avoltage higher than the Zener voltage of the Zener diode D is generatedfrom the vibrator 47 when the vibrator 47 is turned on/off, as indicatedby an arrow of a reference sign C3 in FIG. 4, a current due to thecounter-electromotive force can flow through a closed circuit formed bythe vibrator 47 and the Zener diode D. Therefore, it is possible toprevent the current due to the counter-electromotive force from flowingto an outside of the closed circuit formed by the vibrator 47 and theZener diode D, and to protect the electronic components of the powersupply unit 10 such as the power supply 12 and the LDO regulator 62provided outside the closed circuit.

A capacitor CD9 may be connected to the power supply line 60E.Specifically, in this case, one end of the capacitor CD9 is connected toa node N42 provided in the power supply line 60E, and the other end ofthe capacitor CD9 is connected to the ground line 60N. Here, the nodeN42 is provided on a positive electrode side terminal 47 a side withrespect to the node N41 in the power supply line 60E. In this way, thecapacitor CD9 can be disposed in the closed circuit formed by thevibrator 47 and the Zener diode D described above, and the capacitor CD9can also protect the electronic components of the power supply unit 10such as the power supply 12 and the LDO regulator 62 provided outsidethe closed circuit formed by the vibrator 47 and the Zener diode D. Thecapacitor CD9 may not be provided in the closed circuit described above,but may be provided in the vicinity of the closed circuit. As a specificexample, the capacitor CD9 may be provided between the switch SW3 andthe Zener diode D. Even in this way, the capacitor CD9 and the Zenerdiode D can protect the electronic components of the power supply unit10 such as the power supply 12 and the LDO regulator 62.

The PB3 pin of the MCU 50 is a pin that is connected to the EN pin ofthe first DC/DC converter 63 and outputs a predetermined voltage signal.The MCU 50 can turn on/off the operation of the first DC/DC converter 63by the voltage signal output from the PB3 pin. Specifically, the MCU 50can cause the first DC/DC converter 63 to operate (that is, enable thefirst DC/DC converter 63) by outputting a high-level voltage signal fromthe PB3 pin. Further, the MCU 50 can stop the operation of the firstDC/DC converter 63 (that is, disable the first DC/DC converter 63) byoutputting a low-level voltage signal from the PB3 pin.

The PB4 pin of the MCU 50 is a pin that is connected to the switch SW4described later and provided between the first DC/DC converter 63 andthe discharging terminal 41, and that outputs an on command to turn onthe switch SW4 and an off command to turn off the switch SW4. The MCU 50can supply power to the load 21 as will be described later by outputtingthe on command from the PB4 pin to turn on the switch SW4. Further, theMCU 50 can stop the supply of power to the load 21 by outputting the offcommand from the PB4 pin to turn off the switch SW4. As a specificexample, when the switch SW4 is a switch configured with a MOSFET, thePB4 pin of the MCU 50 is connected to a gate terminal of the MOSFET.Then, the MCU 50 can control on/off of the switch SW4 by controlling agate voltage (that is, an output from the PB4 pin) applied to the gateterminal.

As described above, the PB15 pin of the MCU 50 is a pin that isconnected to the CHG pin of the charging IC 55 and receives input of thecharging state information and the remaining capacity information outputby the charging IC 55.

The PA0 pin of the MCU 50 is a pin that is connected to the switch SW1of the LED circuit C1 and outputs an on command to turn on the switchSW1 and an off command to turn off the switch SW1. The MCU 50 can putthe LED circuit C1 in a conductive state to cause the LED 70 to emitlight (be turned on) by outputting the on command from the PA0 pin toturn on the switch SW1. Further, the MCU 50 can put the LED circuit C1in a non-conductive state to turn off the LED 70 by outputting the offcommand from the PA0 pin to turn off the switch SW1. As a specificexample, when the switch SW1 is a switch configured with a MOSFET, thePA0 pin of the MCU 50 is connected to a gate terminal of the MOSFET.Then, the MCU 50 can control on/off of the switch SW1 by controlling agate voltage (that is, an output from the PA0 pin) applied to the gateterminal. Further, the MCU 50 can switch between the conductive stateand the non-conductive state of the LED circuit C1 at a high speed tocause the LED 70 to blink by outputting while switching the on commandand the off command from the PA0 pin at a high speed.

The PC5 pin of the MCU 50 is a pin that is connected to the OUT pin ofthe intake sensor 15 and receives an output of the intake sensor 15(that is, a signal indicating a detection result of the intake sensor15).

The PA11 pin and the PA12 pin of the MCU 50 are pins used for input andoutput of a signal for communication between the power supply unit 10and the external apparatus. Specifically, as described above, the PA11pin is connected to the A7 pin and the B7 pin of the charging terminal43 via the resistor R2, and is used for input and output of a signal onthe Dn side. Further, as described above, the PA12 pin is connected tothe A6 pin and the B6 pin of the charging terminal 43 via the resistorR1, and is used for input and output of a signal on the Dp side.

The PC12 pin of the MCU 50 is a pin that is connected to the EN pin ofthe second DC/DC converter 64 and outputs a predetermined voltagesignal. The MCU 50 can turn on/off an operation of the second DC/DCconverter 64 by the voltage signal output from the PC12 pin.Specifically, the MCU 50 can cause the second DC/DC converter 64 tooperate (that is, enable the second DC/DC converter 64) by outputting ahigh-level voltage signal from the PC12 pin. Further, the MCU 50 canstop the operation of the second DC/DC converter 64 (that is, disablethe second DC/DC converter 64) by outputting a low-level voltage signalfrom the PC12 pin.

The PB8 pin and the PB9 pin of the MCU 50 are pins used to output asignal for communication between the MCU 50 and another IC, and are usedfor communication between the MCU 50 and the display driver 65 in thepresent embodiment. Specifically, in the present embodiment, the MCU 50and the display driver 65 perform inter-integrated circuit (I2C)communication. The PB8 pin is used to output a signal of the I2Ccommunication on an SCL side, and the PB9 pin is used to output a signalof the I2C communication on an SDA side. The MCU 50 can control thedisplay driver 65 by the signals output from the PB8 pin and the PB9 pinto control a display content of the display 16 (the OLED panel 46).

As described above, the VCC pin of the intake sensor 15 is the powersupply pin of the intake sensor 15 on the positive electrode side, andis connected to the power supply line 60E. The GND pin of the intakesensor 15 is a ground pin of the intake sensor 15 and is connected tothe ground line 60N. Accordingly, the low-voltage system voltage outputfrom the LDO regulator 62 is supplied to the intake sensor 15 via thepower supply line 60E.

As described above, the OUT pin of the intake sensor 15 is a pin thatoutputs the signal indicating the detection result of the intake sensor15, and is connected to the PC5 pin of the MCU 50. Accordingly, theintake sensor 15 can notify the MCU 50 of the detection result.

As described above, the VIN pin of the first DC/DC converter 63 is thepower supply pin of the first DC/DC converter 63 on the positiveelectrode side, and is connected to the power supply line 60D. Further,the VIN pin of the first DC/DC converter 63 is also connected to the SWpin (the switch pin) of the first DC/DC converter 63 via a coil CL1. TheGND pin of the first DC/DC converter 63 is a ground pin of the firstDC/DC converter 63, and is connected to the ground line 60N.

The VOUT pin of the first DC/DC converter 63 is a pin that outputs thefirst high-voltage system voltage generated by the first DC/DC converter63, and is connected to the positive electrode side discharging terminal41 a of the discharging terminal 41 via a power supply line 60F. Thenegative electrode side discharging terminal 41 b of the dischargingterminal 41 is connected to the ground line 60N.

The switch SW4 is provided in the power supply line 60F. The switch SW4is, for example, a switch configured with a MOSFET or the like, and morespecifically, is a power MOSFET having a high switching speed. Theswitch SW4 is connected to the MCU 50 as described above, is turned onin response to the on command of the MCU 50, and is turned off inresponse to the off command of the MCU 50. When the switch SW4 is turnedon, the power supply line 60F is in a conductive state, and the firsthigh-voltage system voltage is supplied to the load 21 via the powersupply line 60F.

A voltage system for causing the load 21 to function (that is, operate)by the first high-voltage system voltage obtained by stepping up thestandard system voltage (that is, the output voltage of the power supply12 or the voltage input via the charging terminal 43) is hereinafteralso referred to as a first step-up system. The first step-up systemwill be described later again with reference to FIG. 5 and the like.

A variable resistor VR4 is connected to the power supply line 60F.Specifically, one end of the variable resistor VR4 is connected to anode N51 provided in the power supply line 60F, and the other end of thevariable resistor VR4 is connected to the ground line 60N. Here, thenode N51 is provided on a positive electrode side discharging terminal41 a side with respect to the switch SW4, that is, on an output side ofthe switch SW4 in the power supply line 60F. In other words, thevariable resistor VR4 is connected between the discharging terminal 41and the power supply 12, more specifically, between the dischargingterminal 41 and the first DC/DC converter 63 (more specifically, theswitch SW4).

Therefore, for example, even when static electricity is generated in thedischarging terminal 41 due to friction between the discharging terminal41 and the load 21 when the first cartridge 20 is replaced, the staticelectricity can be released to the ground line 60N via the variableresistor VR4 to protect the switch SW4, the first DC/DC converter 63,the power supply 12, and the like. Further, even when the variableresistor VR4 fails, the switch SW4 and the first DC/DC converter 63 canserve as a barrier against noise (in this case, the static electricitygenerated in the discharging terminal 41) for another element (forexample, the charging IC 55) on a power supply 12 side with respect tothe switch SW4 and the first DC/DC converter 63, and can protect anotherelement.

A capacitor CD10 that functions as a decoupling capacitor is connectedto the power supply line 60F. Specifically, one end of the capacitorCD10 is connected to a node N52 provided in the power supply line 60F,and the other end of the capacitor CD10 is connected to the ground line60N. Here, the node N52 is provided between the node N51 and the switchSW4 in the power supply line 60F. In other words, the capacitor CD10 isconnected to the output side of the switch SW4. Accordingly, powersupply from the switch SW4 to the load 21 can be stabilized, and evenwhen static electricity is generated in the discharging terminal 41, thevariable resistor VR4 can protect the capacitor CD10 from the staticelectricity.

A capacitor CD11 that functions as a decoupling capacitor may beconnected to the power supply line 60F. Specifically, in this case, oneend of the capacitor CD11 is connected to a node N53 provided in thepower supply line 60F, and the other end of the capacitor CD11 isconnected to the ground line 60N. Here, the node N53 is provided betweenthe switch SW4 and the first DC/DC converter 63 in the power supply line60F. In other words, the capacitor CD11 is connected to an output sideof the first DC/DC converter 63. Accordingly, power supply from thefirst DC/DC converter 63 to the switch SW4 (for example, the powerMOSFET) can be stabilized. As a result, power supply to the load 21 canbe stabilized.

As described above, the EN pin of the first DC/DC converter 63 is a pinfor setting the operation of the first DC/DC converter 63 on/off and isconnected to the PB3 pin of the MCU 50.

The MODE pin of the first DC/DC converter 63 is a pin for setting anoperation mode of the first DC/DC converter 63. The first DC/DCconverter 63 is, for example, a switching regulator, and can have apulse width modulation mode (hereinafter, also referred to as a PWMmode) and a pulse frequency modulation mode (hereinafter, also referredto as a PFM mode) as operation modes. In the present embodiment, whenthe first DC/DC converter 63 can operate, the MODE pin is connected tothe power supply line 60D, so that a high-level voltage is input to theMODE pin, and the first DC/DC converter 63 is set to operate in the PWMmode.

As described above, the VIN pin of the second DC/DC converter 64 is thepower supply pin of the second DC/DC converter 64 on the positiveelectrode side, and is connected to the power supply line 60D. Further,the VIN pin of the second DC/DC converter 64 is also connected to the SWpin (the switch pin) of the second DC/DC converter 64 via a coil CL2.The GND pin of the second DC/DC converter 64 is a ground pin of thesecond DC/DC converter 64 and is connected to the ground line 60N.

The VOUT pin of the second DC/DC converter 64 is a pin that outputs thesecond high-voltage system voltage generated by the second DC/DCconverter 64, and is connected to the VCC_C pin of the display driver 65via a power supply line 60G. Accordingly, the second DC/DC converter 64can supply the second high-voltage system voltage to the display driver65.

A variable resistor VR5 is connected to the power supply line 60G.Specifically, one end of the variable resistor VR5 is connected to anode N61 provided in the power supply line 60G, and the other end of thevariable resistor VR5 is connected to the ground line 60N. In otherwords, the variable resistor VR5 is connected between a connectorportion connected to the VCC_C pin of the display driver 65 and thesecond DC/DC converter 64 in the power supply line 60G.

Therefore, even when static electricity is generated in the display 16by contact of the display 16 exposed to an outside of the aerosolinhaler 1 with any object (for example, a hand of the user) and thestatic electricity flows back to a second DC/DC converter 64 side viathe OLED panel 46 and the display driver 65, the static electricity canbe released to the ground line 60N via the variable resistor VR5, andthe second DC/DC converter 64 and the like can be protected from thestatic electricity. Further, even when the variable resistor VR5 fails,the second DC/DC converter 64 can serve as a barrier against noise (inthis case, the static electricity generated in the display 16) foranother element (for example, the LDO regulator 62) on the power supply12 side with respect to the variable resistor VR5, and can protectanother element. That is, in the power supply line 60G, by providing thenode N62 on a second DC/DC converter side with respect to the node N61,it is possible to achieve both protection of the display driver 65 fromovervoltage and a stable operation of the display driver 65.

From the same viewpoint, a variable resistor VR6 is also connected tothe power supply line 60E. Specifically, one end of the variableresistor VR6 is connected to a node N43 provided in the power supplyline 60E, and the other end of the variable resistor VR6 is connected tothe ground line 60N. Here, the node N43 is provided between the LDOregulator 62 and the switch SW3 in the power supply line 60E. Therefore,even when static electricity is generated in the display 16 by contactof the display 16 exposed to the outside of the aerosol inhaler 1 withany object and the static electricity flows back to an LDO regulator 62side via the OLED panel 46 and the display driver 65, the staticelectricity can be released to the ground line 60N via the variableresistor VR6, and the LDO regulator 62 can be protected from the staticelectricity.

A capacitor CD12 that functions as a decoupling capacitor is connectedto the power supply line 60G. Specifically, one end of the capacitorCD12 is connected to a node N62 provided in the power supply line 60G,and the other end of the capacitor CD12 is connected to the ground line60N. Here, the node N62 is provided on the second DC/DC converter 64side with respect to the node N61 in the power supply line 60G.Accordingly, a stable second high-voltage system voltage can be suppliedto the display driver 65, and even when static electricity is generatedin the display 16, the variable resistor VR5 can protect the capacitorCD12 from the static electricity.

The EN pin of the second DC/DC converter 64 is a pin for setting theoperation of the second DC/DC converter 64 on/off and is connected tothe PC12 pin of the MCU 50 as described above.

As described above, the VDD pin of the display driver 65 is the powersupply pin of the display driver 65 on the positive electrode side andis connected to the power supply line 60E. Further, the VSS pin of thedisplay driver 65 is a power supply pin of the display driver 65 on anegative electrode side and is connected to the ground line 60N.Accordingly, the low-voltage system voltage output from the LDOregulator 62 is supplied to the display driver 65 via the power supplyline 60E. The low-voltage system voltage supplied to the display driver65 is used as a power supply for operating the display driver 65.

The VCC_C pin of the display driver 65 is a pin that receives the secondhigh-voltage system voltage, and is connected to the VOUT pin of thesecond DC/DC converter 64 via the power supply line 60G as describedabove. When receiving the second high-voltage system voltage by theVCC_C pin, the display driver 65 supplies the received secondhigh-voltage system voltage to the OLED panel 46 via a power supply line60H. Accordingly, the display driver 65 can cause the OLED panel 46 tooperate. The display driver 65 and the OLED panel 46 may also beconnected by another line (not shown).

A voltage system for causing the OLED panel 46 to function (that is,operate) by the second high-voltage system voltage obtained by steppingup the standard system voltage (that is, the output voltage of the powersupply 12 or the voltage input via the charging terminal 43) ishereinafter also referred to as a second step-up system. The secondstep-up system will be described later again with reference to FIG. 5and the like.

The SCL pin of the display driver 65 is a pin that receives a signal onan SCL side in I2C communication between the MCU 50 and the displaydriver 65, and is connected to the PB8 pin of the MCU 50 as describedabove. Further, the SDA pin of the display driver 65 is a pin thatreceives a signal on an SDA side in the I2C communication between theMCU 50 and the display driver 65, and is connected to the PB9 pin of theMCU 50 as described above.

The IXS pin of the display driver 65 is a pin for setting which of theI2C communication and serial peripheral interface (SPI) communication isused to perform communication between the display driver 65 and anotherIC (the MCU 50 in the present embodiment). In the present embodiment, byconnecting the IXS pin to the power supply line 60E, a high-levelvoltage is input to the IXS pin, and the communication between thedisplay driver 65 and the MCU 50 is set to be performed by the I2Ccommunication. The communication between the display driver 65 and theMCU 50 may be set to be performed by the SPI communication by inputtinga low-level voltage to the IXS pin.

(Systems of Power Supply Unit 10)

Here, the systems of the power supply unit 10 described above aresummarized with reference to FIG. 5. In FIG. 5, illustration of theprotection IC 61 and the like is omitted. As shown in FIG. 5, the powersupply unit 10 includes a first step-up system Gr1, a second step-upsystem Gr2, a direct-coupling system Gr3, and a step-down system Gr4.The first step-up system Gr1, the second step-up system Gr2, thedirect-coupling system Gr3, and the step-down system Gr4 are provided inparallel with the charging IC 55. Further, the power supply 12 and thecharging terminal 43 are also provided in parallel with the charging IC55. In other words, the first step-up system Gr1, the second step-upsystem Gr2, the direct-coupling system Gr3, and the step-down system Gr4are provided in parallel with the power supply 12 and the chargingterminal 43 via the charging IC 55.

The first step-up system Gr1 includes the first DC/DC converter 63 thatsteps up the standard system voltage to the first high-voltage systemvoltage, the switch SW4 that is a power MOSFET that supplies the firsthigh-voltage system voltage generated by the first DC/DC converter 63 tothe load 21, and the load 21 that is a load that functions (that is,operates) when the first high-voltage system voltage is supplied. In thefirst step-up system Gr1, a load operated by the first high-voltagesystem voltage is only the load 21. That is, in the first step-up systemGr1, the number of loads operated by the first high-voltage systemvoltage is set to 1. It should be noted that, since the switch SW4functions by the on command and the off command output from the PB4 pinof the MCU 50 as described above, the switch SW4 is not included in theload that functions (that is, operates) when the first high-voltagesystem voltage is supplied.

Accordingly, in the first step-up system Gr1 in which power consumptionis relatively large due to step-up, by setting one load, it is possibleto reduce an opportunity to cause the first step-up system Gr1 tofunction, a time during which the first step-up system Gr1 continuouslyfunctions, and power consumed by the first step-up system Gr1 per unittime, as compared with a case where a plurality of loads are provided.Accordingly, the power consumption of the first step-up system Gr1 canbe suppressed. Therefore, efficiency of power consumption of the aerosolinhaler 1 can be improved, and for example, an amount of an aerosolgenerated per power for one charging of the power supply 12 and a flavorof the aerosol inhaler 1 can be improved.

The second step-up system Gr2 includes the second DC/DC converter 64that steps up the standard system voltage to the second high-voltagesystem voltage, the display driver 65 that supplies the secondhigh-voltage system voltage generated by the second DC/DC converter 64to the OLED panel 46, and the OLED panel 46 that is a load thatfunctions (that is, operates) when the second high-voltage systemvoltage is supplied. As described above, the VDD pin, which is the powersupply pin of the display driver 65 on the positive electrode side, isconnected to the OUT pin of the LDO regulator 62 via the node N43.Therefore, in the second step-up system Gr2, a load operated by thesecond high-voltage system voltage is only the OLED panel 46. That is,in the second step-up system Gr2, the number of loads operated by thesecond high-voltage system voltage is set to 1.

Accordingly, compared with a case where a plurality of loads areprovided in the second step-up system Gr2, it is possible to reduce anopportunity to cause the second step-up system Gr2 to function, a timeduring which the second step-up system Gr2 continuously functions, andpower consumed by the second step-up system Gr2 per unit time.Accordingly, the power consumption of the second step-up system Gr2 canbe suppressed. Therefore, the efficiency of the power consumption of theaerosol inhaler 1 can be improved, and for example, the amount of theaerosol generated per power for one charging of the power supply 12 andthe flavor of the aerosol inhaler 1 can be improved.

A configuration is adopted in which one step-up DC/DC converter isprovided for one load that requires step-up, such as providing the firstDC/DC converter 63 for the load 21 and providing the second DC/DCconverter 64 for the OLED panel 46, so that it is possible to use anappropriate DC/DC converter for each load, to reduce a loss duringstep-up of each DC/DC converter, and to improve the efficiency of thepower consumption of the aerosol inhaler 1.

The direct-coupling system Gr3 includes the LED 70 that is a load thatfunctions (that is, operates) when the standard system voltage issupplied. Further, in the direct-coupling system Gr3, the switch SW1 isprovided in front of the LED 70, that is, between the charging IC 55 andthe LED 70.

Although details will be described later, the LED 70 is a load thatfunctions more frequently than other loads of the aerosol inhaler 1 suchas the load 21, the OLED panel 46, and the vibrator 47. Accordingly, byproviding the load that functions more frequently than other loads inthe direct-coupling system Gr3 in which there is no loss due to voltageconversion, it is possible to suppress power consumption when the loadfunctions, and to improve the efficiency of the power consumption of theaerosol inhaler 1.

The LED 70 is a load that consumes less power when functioning thanother loads of the aerosol inhaler 1, such as the load 21, the OLEDpanel 46, and the vibrator 47. Accordingly, by setting the load thatfunctions more frequently than other loads as a load having low powerconsumption, it is possible to suppress power consumption due tofunctioning of the load and to improve the efficiency of the powerconsumption of the aerosol inhaler 1.

The step-down system Gr4 includes the LDO regulator 62 that steps downthe standard system voltage to the low-voltage system voltage, the MCU50, the vibrator 47, and the intake sensor 15 that are loads thatfunction when the low-voltage system voltage is supplied. In thestep-down system Gr4, the MCU 50, the vibrator 47, and the intake sensor15 are provided in parallel with the LDO regulator 62. Further, in thestep-down system Gr4, the switch SW3 is provided between the LDOregulator 62 and the vibrator 47.

In the step-down system Gr4, loads operated by the low-voltage systemvoltage are the MCU 50, the vibrator 47, and the intake sensor 15. Thatis, in the step-down system Gr4, the number of loads operated by thelow-voltage system voltage is larger than the number of loads in thefirst step-up system Gr1, the second step-up system Gr2, and thedirect-coupling system Gr3.

Accordingly, in the step-down system Gr4 in which power consumption isrelatively reduced by step-down, by providing a plurality of loads, itis possible to achieve high functionality of the aerosol inhaler 1 whilesuppressing the power consumption of the aerosol inhaler 1. Further, bysuppressing the power consumption of the aerosol inhaler 1, it ispossible to improve the amount of the aerosol generated per power forone charging of the power supply 12 and the flavor of the aerosolinhaler 1.

(MCU)

Next, a configuration of the MCU 50 will be described with reference toFIG. 6. As shown in FIG. 6, the MCU 50 includes an aerosol generationrequest detection unit 51, a temperature detection unit 52, a powercontrol unit 53, and a notification control unit 54 as functional blocksimplemented by the processor executing a program stored in a ROM (notshown).

The aerosol generation request detection unit 51 detects an aerosolgeneration request based on an output result of the intake sensor 15.The intake sensor 15 is configured to output a value of a change in apressure (an internal pressure) in the power supply unit 10 caused bysuction of the user through the suction port 32. The intake sensor 15is, for example, a pressure sensor that outputs an output value (forexample, a voltage value or a current value) corresponding to aninternal pressure that changes according to a flow rate of air suckedfrom an intake port (not shown) toward the suction port 32 (that is, apuff operation of the user). The intake sensor 15 may be configured witha condenser microphone or the like. The intake sensor 15 may output ananalog value or may output a digital value converted from the analogvalue. Further, the intake sensor 15 may transmit an output to theaerosol generation request detection unit 51 by using the I2Ccommunication, the SPI communication, or the like described above.

The temperature detection unit 52 detects a temperature of the powersupply 12 based on an input from the thermistor circuit C2.Specifically, the temperature detection unit 52 applies a voltage to thethermistor circuit C2 by turning on the switch SW2, and detects atemperature of the thermistor TH, that is, the temperature of the powersupply 12 based on a voltage value input from the thermistor circuit C2to the MCU 50 (for example, the PCI pin) at that time. Further, forexample, an electric resistance value of the load 21 may be configuredto be detectable, and the temperature detection unit 52 may detect atemperature of the load 21.

The power control unit 53 controls a supply of power to the electroniccomponents of the aerosol inhaler 1. For example, when the aerosolgeneration request detection unit 51 detects the aerosol generationrequest, the power control unit 53 causes the first DC/DC converter 63to operate and controls switching of the switch SW4 to supply the firsthigh-voltage system voltage to the load 21 via the positive electrodeside discharging terminal 41 a. Accordingly, the MCU 50 can supply powerof the first high-voltage system voltage to the load 21, cause the load21 to be heated (to function), and cause an aerosol to be generated.Then, in this way, power from the charging IC 55 (that is, power of thestandard system voltage) is stepped up to the first high-voltage systemvoltage by the first DC/DC converter 63 and supplied to the load 21, sothat an amount of an aerosol generated by the load 21 and a flavor canbe improved as compared with a case where the power from the charging IC55 is supplied to the load 21 without being stepped up.

The power control unit 53 supplies the standard system voltage to thevibrator 47 via the positive electrode side terminal 47 a by turning onthe switch SW3 at a predetermined timing. Accordingly, the MCU 50 cansupply the power of the standard system voltage to the vibrator 47 tocause the vibrator 47 to vibrate (function).

The power control unit 53 supplies the second high-voltage systemvoltage to the OLED panel 46 via the display driver 65 by causing thesecond DC/DC converter 64 to operate at a predetermined timing.Accordingly, the MCU 50 can supply power of the second high-voltagesystem voltage to the OLED panel 46 to cause the OLED panel 46 tooperate (function).

When the aerosol generation request detection unit 51 detects theaerosol generation request, the power control unit 53 further turns onthe switch SW1 to put the LED circuit C1 in a conductive state, andcauses the LED 70 to emit light (function). In this case, a voltageobtained by lowering the standard system voltage from the charging IC 55by the resistor R8 is supplied to the connector 70 a. That is, byturning on the switch SW1, the power control unit 53 can supply power ofthe voltage obtained by lowering the standard system voltage by theresistor R8 to the LED 70 via the connector 70 a.

As described above, when the power supply 12 is in the over-dischargedstate, the MCU 50 cannot operate only with the power of the power supply12 and is in the stopped state. The MCU 50, which is in the stoppedstate as described above, is reactivated when power is subsequentlysupplied from the external power supply via the charging terminal 43.Then, the reactivated MCU 50 performs predetermined power supply controlto recover the system of the power supply unit 10 by a function of thepower control unit 53 or the like. A specific example of the powersupply control will be described later with reference to FIGS. 7 to 12and the like.

The notification control unit 54 controls the notification unit 45 tonotify various pieces of information. For example, the notificationcontrol unit 54 controls the notification unit 45 to notify areplacement timing of the second cartridge 30 in response to detectionof the replacement timing of the second cartridge 30. The notificationcontrol unit 54 detects and notifies the replacement timing of thesecond cartridge 30 based on a cumulative number of times of the puffoperation or a cumulative energization time to the load 21 stored in thememory 19. The notification control unit 54 may notify not only thereplacement timing of the second cartridge 30, but also a replacementtiming of the first cartridge 20, a replacement timing of the powersupply 12, a charging timing of the power supply 12, and the like.

In a state where one unused second cartridge 30 is set, when the puffoperation is performed a predetermined number of times, or when thecumulative energization time to the load 21 by the puff operationreaches a predetermined value (for example, 120 seconds), thenotification control unit 54 may determine that the second cartridge 30has been used (that is, the remaining amount is zero or empty), and maynotify the replacement timing of the second cartridge 30.

When it is determined that all of the second cartridges 30 included inthe one set have been used, the notification control unit 54 maydetermine that one first cartridge 20 included in the one set has beenused (that is, the remaining amount is zero or empty), and may notifythe replacement timing of the first cartridge 20. In addition to orinstead of these, the notification control unit 54 may also notify aremaining amount of the first cartridge 20, a remaining amount of thesecond cartridge 30, a remaining capacity of the power supply 12, andthe like.

(Specific Example of Power Supply Control)

Next, a specific example of the above-described power supply controlwill be described with reference to FIGS. 7 to 12. In FIGS. 7 to 12, aportion to which power is supplied is indicated by a solid line, and aportion to which power is not supplied is indicated by a dotted line orhatched. In FIGS. 7 to 12, illustration of the protection IC 61, theswitch SW1, the vibrator 47, the intake sensor 15, and the like isomitted.

When the power supply 12 is in the over-discharged state, a switch 121electrically connected to the power supply 12 is turned off as shown inFIG. 7 in order to prevent deterioration of the power supply 12.Accordingly, the power supply 12 is electrically disconnected from thesystem of the power supply unit 10. Here, the switch 121 is, forexample, a switch configured with a battery pack that implements thepower supply 12, a MOSFET built in the charging IC 55, or the like. Whenthe power supply 12 is electrically disconnected from the system of thepower supply unit 10, an output of the power supply 12 is not input tothe VBAT pin of the protection IC 61 and the BAT_1 pin and the BAT_2 pinof the charging IC 55. As a result, the protection IC 61 and thecharging IC 55 cannot recognize the power supply 12.

Then, when a plug connected to the external power supply is insertedinto the charging terminal 43, as shown in FIG. 8, power received by thecharging terminal 43 from the external power supply is supplied to thecharging IC 55. Accordingly, the charging IC 55 is activated. When thepower supply 12 is electrically disconnected from the system of thepower supply unit 10, as described above, since the output of the powersupply 12 is not input to the BAT_1 pin and the BAT_2 pin of thecharging IC 55, the charging IC 55 cannot recognize the power supply 12.Further, at this time point, since the MCU 50 is not activated, apotential of the CE pin of the charging IC 55 becomes indefinite.Therefore, the activated charging IC 55 does not charge the power supply12 at this time point.

As shown in FIG. 9, the activated charging IC 55 supplies power receivedfrom the external power supply to the LDO regulator 62 by using thepower-path function. Accordingly, electric charge is accumulated in thecapacitor CD8, and the LDO regulator 62 is activated.

As shown in FIG. 9, at this time point, power is not supplied to the MCU50, and the MCU 50 is not activated. When the MCU 50 is not activated inthis way, the charging IC 55 does not supply power to the power supply12. Accordingly, when the MCU 50 is not activated, that is, when the MCU50 cannot control the charging IC 55, power supply to the power supply12 (that is, charging the power supply 12) can be prevented, andinappropriate charging that leads to deterioration of the power supply12 can be prevented. Therefore, the deterioration of the power supply 12due to the inappropriate charging can be prevented, and the power supply12 in the over-discharged state can be safely recovered.

The charging IC 55 does not supply power to the load 21 when the MCU 50is not activated. Specifically, at the time point shown in FIG. 9, aninput to the EN pin of the first DC/DC converter 63 is indefinite.Therefore, since the first DC/DC converter 63, that is, the firststep-up system Gr1 does not function, power is not supplied to the load21. Accordingly, when the MCU 50 is not activated, that is, when the MCU50 cannot control the charging IC 55, the power supply to the load 21can be prevented, and inappropriate heating or the like by the load 21can be prevented.

Then, as shown in FIG. 10, the LDO regulator 62 activated by power fromthe charging IC 55 supplies power of the low-voltage system voltage tothe MCU 50. Accordingly, the MCU 50 in the stopped state is activated(reactivated). Then, the reactivated MCU 50 controls the charging IC 55to start charging the power supply 12 as indicated by an arrow of areference sign (A) in FIG. 10. Specifically, the MCU 50 outputs alow-level voltage signal to the CE pin of the charging IC 55.Accordingly, the power supply 12 is charged with power received from theexternal power supply. The switch 121 is turned on (in a conductivestate) when a power supply from the charging IC 55 to the power supply12 is started.

At this time, the charging IC 55 gradually charges the power supply 12.For example, the MCU 50 intermittently switches a signal output to theCE pin of the charging IC 55 between a low level and a high level.Accordingly, the power supply 12 can be gradually charged, and the powersupply 12 can be charged while preventing a burden on the power supply12 (that is, deterioration of the power supply 12). As another example,when the output voltage of the power supply 12, which is input to theBAT_1 pin and the BAT_2 pin via the switch 121 turned on as the powersupply to the power supply 12 is started, indicates that the powersupply 12 is in the over-discharged state, the charging IC 55 mayperiodically switch on/off the switch 121 to gradually charge the powersupply 12.

Thereafter, the MCU 50 outputs a high-level voltage signal to the EN pinof the second DC/DC converter 64 as indicated by an arrow of a referencesign (B) in FIG. 11. Accordingly, the second DC/DC converter 64, thatis, the second step-up system Gr2 functions, and power can be suppliedto the OLED panel 46. Further, the MCU 50 can also cause the LED 70(that is, the direct-coupling system Gr3) to function as indicated by anarrow of a reference sign (C) in FIG. 11. In order to cause the LED 70to function, the switch SW1 provided in the LED circuit C1 may be turnedon.

It is preferable that the MCU 50 does not supply power to the load 21while charging the power supply 12. That is, the load 21 generates heatwhen power is supplied. Therefore, if power is supplied to the load 21while charging the power supply 12, a temperature of the power supply 12also increases due to an influence of heat from the load 21, and thehigh-temperature power supply 12 may be charged (that is, may lead todeterioration of the power supply 12).

Therefore, it is possible to prevent the deterioration of the powersupply 12 by not supplying power to the load 21 while charging the powersupply 12. In order not to supply power to the load 21, the MCU 50 mayoutput a low-level voltage signal to the EN pin of the first DC/DCconverter 63.

Then, when the charging of the power supply 12 is finished (for example,when the plug is removed from the charging terminal 43), the MCU 50 canoutput a high-level voltage signal to the EN pin of the first DC/DCconverter 63 as indicated by an arrow of a reference sign (D) in FIG.12. Accordingly, the first DC/DC converter 63, that is, the firststep-up system Gr1 functions, and power can be supplied to the load 21.

It is preferable that the MCU 50 does not supply power to the load 21until the over-discharged state of the power supply 12 is resolved. Thatis, if the over-discharged state of the power supply 12 is not resolved,the MCU 50 is in a stopped state at a moment when the plug is removedfrom the charging terminal 43. Therefore, even when the over-dischargedstate of the power supply 12 is not resolved, if power is supplied tothe load 21, the power supply to the load 21 cannot be controlled at themoment when the plug is removed from the charging terminal 43,inappropriate heating or the like by the load 21 may be performed, andan aerosol having an unintended flavor may be generated. Therefore, bynot supplying power to the load 21 until the over-discharged state ofthe power supply 12 is resolved, it is possible to prevent theinappropriate heating or the like by the load 21 and the generation ofthe aerosol having the unintended flavor.

When the first step-up system Gr1 and the second step-up system Gr2function at the same time, that is, when a power supply to the load 21and a power supply to the OLED panel 46 are performed at the same time,discharging from the power supply 12 can have a large current. When thelarge current is discharged from the power supply 12 in this way, theburden on the power supply 12 becomes large, which may lead to thedeterioration of the power supply 12. Therefore, in order to prevent thedischarging of the large current from the power supply 12, the MCU 50may not cause the first step-up system Gr1 and the second step-up systemGr2 to function at the same time. Accordingly, the deterioration of thepower supply 12 due to the discharging of the large current from thepower supply 12 can be prevented.

(Arrangement Example of Charging IC 55)

When power is also supplied to the LDO regulator 62 or the like by usingthe power-path function while charging the power supply 12, it isconceivable that a burden on the charging IC 55 increases and thecharging IC 55 generates heat while charging the power supply 12.Therefore, if the charging IC 55 is disposed close to the power supply12, the power supply 12 may be heated by heat of the charging IC 55while charging the power supply 12, and the high-temperature powersupply 12 may be charged (that is, may lead to the deterioration of thepower supply 12).

Therefore, in the present embodiment, the charging IC 55 is provided onthe second surface in the circuit board 60 including the first surfacethat faces the power supply 12 and the second surface positioned on theback side of the first surface. Accordingly, it is possible to preventthe power supply 12 from being heated by the heat of the charging IC 55while charging the power supply 12. That is, an influence of the heat ofthe charging IC 55 on the temperature of the power supply 12 can bereduced. Hereinafter, a specific example of the circuit board 60 onwhich a plurality of elements are mounted will be described withreference to FIGS. 2 and 13 to 16. It should be noted that FIGS. 13 to16 only disclose main parts of a circuit configuration of the circuitboard 60.

(Circuit Board)

As shown in FIG. 2, the circuit board 60 includes a first surface 71 anda second surface 72 positioned on a back side of the first surface 71.The first surface 71 and the second surface 72 are surfacessubstantially perpendicular to the left-right direction. Then, the firstsurface 71 constitutes a right surface of the circuit board 60, and thesecond surface 72 constitutes a left surface of the circuit board 60.Then, the second surface 72 faces the power supply 12, and/or the secondsurface 72 is disposed closer to the power supply 12 than the firstsurface 71. In the present embodiment, the second surface 72 faces thepower supply 12.

A plurality of elements are mounted on the first surface 71 thatconstitutes the right surface of the circuit board 60 and the secondsurface 72 that constitutes the left surface of the circuit board 60.

As shown in FIGS. 7 to 10, the circuit board 60 further includes aground layer 73 and a power supply layer 74, and the ground layer 73 andthe power supply layer 74 are provided between the first surface 71 andthe second surface 72. That is, in the present embodiment, the circuitboard 60 is a four-layer multilayer board in which the first surface 71,the ground layer 73, the power supply layer 74, and the second surface72 are stacked. In the present embodiment, the circuit board 60 isconfigured by stacking the first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 in this order from aright side. Instead of the present embodiment, the circuit board 60 maybe a multilayer board having five or more layers by having at least oneof the first surface 71, the ground layer 73, the power supply layer 74,and the second surface 72 having multiple layers. Further, the firstsurface 71, the ground layer 73, the power supply layer 74, and thesecond surface 72 may be divided into two or more groups, and may bestacked only in the same group. It should be noted that, in this case,the circuit board 60 is physically divided into two or more, but anorder in which the first surface 71, the ground layer 73, the powersupply layer 74, and the second surface 72 are arranged in theleft-right direction is not changed.

The circuit board 60 has a substantially L shape as a whole when viewedfrom the left-right direction substantially perpendicular to the firstsurface 71 and the second surface 72 on which the plurality of elementsare mounted. Specifically, when viewed from the left-right direction,the circuit board 60 includes a coupling portion 600 having asubstantially quadrangular shape, a first portion 601 that extendsforward from a front end surface of the coupling portion 600, and asecond portion 602 that extends upward from an upper end surface of thecoupling portion 600. The first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 have substantially thesame shape, and are substantially L-shaped when viewed from theleft-right direction. Specifically, when viewed from the left-rightdirection, the first surface 71 includes a coupling portion 710 having asubstantially quadrangular shape, a first portion 711 that extendsforward from a front end portion of the coupling portion 710, and asecond portion 712 that extends upward from an upper end surface of thecoupling portion 710. When viewed from the left-right direction, thesecond surface 72 includes a coupling portion 720 having a substantiallyquadrangular shape, a first portion 721 that extends forward from afront end portion of the coupling portion 720, and a second portion 722that extends upward from an upper end surface of the coupling portion720. When viewed from the left-right direction, the ground layer 73includes a coupling portion 730 having a substantially quadrangularshape, a first portion 731 that extends forward from a front end portionof the coupling portion 730, and a second portion 732 that extendsupward from an upper end surface of the coupling portion 730. Whenviewed from the left-right direction, the power supply layer 74 includesa coupling portion 740 having a substantially quadrangular shape, afirst portion 741 that extends forward from a front end portion of thecoupling portion 740, and a second portion 742 that extends upward froman upper end surface of the coupling portion 740. The coupling portion600 of the circuit board 60 is formed by the coupling portions 710, 730,740, and 720 respectively of the first surface 71, the ground layer 73,the power supply layer 74, and the second surface 72. The first portion601 of the circuit board 60 is formed by the first portions 711, 731,741, and 721 respectively of the first surface 71, the ground layer 73,the power supply layer 74, and the second surface 72. The second portion602 is formed by the second portions 712, 732, 742, and 722 respectivelyof the first surface 71, the ground layer 73, the power supply layer 74,and the second surface 72.

As shown in FIG. 13, the elements such as the display driver 65, thesecond DC/DC converter 64, the MCU 50, the charging IC 55, the LDOregulator 62, the protection IC 61, the first DC/DC converter 63, and apower supply connector 81 are mounted on the first surface 71 of thecircuit board 60. Further, an intake sensor connection portion 82, aswitch connection portion 83, and a vibrator connection portion 84 areformed on the first surface 71 of the circuit board 60.

The display driver 65 is mounted above a center of the second portion712 in the upper-lower direction. The OLED panel 46 is disposed abovethe circuit board 60, and the display driver 65 and the OLED panel 46are connected by the power supply line 60H.

The second DC/DC converter 64 is mounted slightly above the center ofthe second portion 712 in the upper-lower direction and in front of andbelow the display driver 65.

The MCU 50 is mounted at a position that straddles a lower end portionof the second portion 712 and an upper end portion of the couplingportion 710.

The charging IC 55 is mounted on a rear end portion of the first portion711.

Accordingly, the charging IC 55 is mounted on the first surface 71positioned on the back side of the second surface 72 that faces thepower supply 12 and/or is disposed close to the power supply 12.Accordingly, the power supply 12 can be prevented from being heated byheat generated by the charging IC 55 during charging of the power supply12.

The LDO regulator 62 is mounted between the MCU 50 and the charging IC55 in the front-rear direction at a substantially central portion of thecoupling portion 710 in the upper-lower direction.

Accordingly, the LDO regulator 62 is mounted on the first surface 71positioned on the back side of the second surface 72 that faces thepower supply 12 and/or is disposed close to the power supply 12.Accordingly, the power supply 12 can be prevented from being heated byheat generated by the LDO regulator 62 during the charging of the powersupply 12.

The protection IC 61 is mounted at a position that is below the chargingIC 55 and the LDO regulator 62 and straddles the coupling portion 710and the first portion 711.

The first DC/DC converter 63 is mounted on a front upper end portion ofthe first portion 711.

Accordingly, the first DC/DC converter 63 is mounted on the firstsurface 71 positioned on the back side of the second surface 72 thatfaces the power supply 12 and/or is disposed close to the power supply12. Therefore, the power supply 12 can be prevented from being heated byheat generated when the first DC/DC converter 63 functions.

The power supply connector 81 is a connector for electrically connectingthe circuit board 60 to the power supply 12, and is mounted below thefirst DC/DC converter 63 and on a lower end portion of the first portion711. A power line connected to the power supply 12 is connected to thepower supply connector 81.

The intake sensor connection portion 82 is formed at a substantiallycentral portion in the upper-lower direction of a front end portion ofthe second portion 712. A power line connected to the intake sensor 15is soldered to the intake sensor connection portion 82.

The switch connection portion 83 is formed at a substantially centralportion in the upper-lower direction of a rear end portion of the secondportion 712. A power line connected to the operation unit 18 is solderedto the switch connection portion 83.

The vibrator connection portion 84 is formed at a rear lower end portionof the coupling portion 710. A power line connected to the positiveelectrode side terminal 47 a and the negative electrode side terminal 47b of the vibrator 47 is soldered to the vibrator connection portion 84.

Therefore, the first DC/DC converter 63 and the second DC/DC converter64 are mounted on the circuit board 60 such that the first DC/DCconverter 63 and the second DC/DC converter 64 are separated from eachother. More specifically, the first DC/DC converter 63 is mounted on thefirst portion 601 of the circuit board 60, and the second DC/DCconverter 64 is mounted on the second portion 602 of the circuit board60. Further, the first DC/DC converter 63 is mounted on the firstportion 601 of the circuit board 60, the second DC/DC converter 64 ismounted on the second portion 602 of the circuit board 60, and the MCU50 is mounted at the position that straddles the lower end portion ofthe second portion 712 and the upper end portion of the coupling portion710 of the circuit board 60. Accordingly, a distance between the firstDC/DC converter 63 and the second DC/DC converter 64 is longer than adistance between the first DC/DC converter 63 and the MCU 50 and longerthan a distance between the second DC/DC converter 64 and the MCU 50.The term “distance” here refers to a shortest distance by which twoobjects are connected with a straight line (that is, a straight-linedistance). The same applies to the following description.

Accordingly, since the first DC/DC converter 63 and the second DC/DCconverter 64 are mounted on the circuit board 60 such that the firstDC/DC converter 63 and the second DC/DC converter 64 are separated fromeach other, the first DC/DC converter 63 and the second DC/DC converter64 can reduce an influence of heat or switching noise generated by oneof the DC/DC converters on the other DC/DC converter.

Since both the first DC/DC converter 63 and the second DC/DC converter64 are mounted on the first surface 71 of the circuit board 60, thefirst DC/DC converter 63 and the second DC/DC converter 64 are arrangedon the same surface. The second surface 72 on which the first DC/DCconverter 63 and the second DC/DC converter 64 are not mounted can beless likely to be influenced by the heat or the switching noisegenerated by the DC/DC converter.

As shown in FIG. 16, the LED 70, the discharging terminal 41, a powermodule 85, the charging terminal 43, and the thermistor TH are mountedon the second surface 72 of the circuit board 60.

The LED 70 is mounted on a substantially central portion in theupper-lower direction of a rear end portion of the second portion 722.

The discharging terminal 41 is mounted so as to protrude upward from anupper end portion of the first portion 721. The discharging terminal 41is a pin or the like with a built-in spring, is connected to the load 21of the first cartridge 20, and power of the power supply 12 is suppliedfrom the discharging terminal 41 to the load 21.

The power module 85 is mounted on the first portion 721 below thedischarging terminal 41. The power module 85 includes the switch SW4,the capacitor CD10, and the variable resistor VR4. Further, although thepower module 85 includes the switch SW4, the power module 85 may includeno capacitor CD10 and no variable resistor VR4. In this case, thecapacitor CD10 and the variable resistor VR4 may be provided between thedischarging terminal 41 and the power module 85.

The charging terminal 43 is mounted so as to protrude downward from alower end portion of the second surface 72 at a position that straddlesthe coupling portion 720 and the first portion 721 in the front-reardirection.

Further, when viewed from the left-right direction, on the first surface71 positioned on the back side of the second surface 72, at least a partof the protection IC 61 is mounted on a region overlapping the chargingterminal 43 mounted on the second surface 72 (see FIG. 13).

Accordingly, the elements can be mounted on the circuit board 60 at ahigh density, and the circuit board 60 can be further miniaturized.

The thermistor TH is mounted on a region on a rear side and a lower sideof the coupling portion 720. Therefore, the thermistor TH is mounted ona rear lower end portion of the entire second surface 72.

Since the thermistor TH is mounted on the second surface 72 that facesthe power supply 12 and/or is disposed closer to the power supply 12than the first surface 71, the thermistor TH can be disposed so as toface the power supply 12 and/or disposed close to the power supply 12.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

The thermistor TH and the resistor R9 form the thermistor circuit C2 onthe second surface 72. The resistor R9 is mounted on the second surface72 in front of the thermistor TH. The thermistor TH is disposed awayfrom the resistor R9, and at least one of the plurality of elements ismounted at a position where a straight-line distance starting from theresistor R9 is shorter than a straight-line distance between theresistor R9 and the thermistor TH. In the present embodiment, the switchSW2 is mounted at the position where the straight-line distance startingfrom the resistor R9 is shorter than the straight-line distance betweenthe resistor R9 and the thermistor TH.

Accordingly, since the thermistor TH is mounted on the second surface 72away from the resistor R9, the thermistor TH is less likely to beinfluenced by heat generated by the resistor R9. Accordingly, thethermistor TH can detect a temperature of the power supply 12 moreaccurately.

Since the thermistor TH is mounted on the second surface 72 differentfrom the first surface 71 on which the MCU 50 is mounted, the thermistorTH is less likely to be influenced by heat generated by the MCU 50.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

Since the first DC/DC converter 63 is mounted on the first surface 71different from the second surface 72 on which the thermistor TH ismounted, the thermistor TH is less likely to be influenced by heatgenerated by the first DC/DC converter 63. Accordingly, the thermistorTH can detect a temperature of the power supply 12 more accurately.

Since the LDO regulator 62 is mounted on the first surface 71 differentfrom the second surface 72 on which the thermistor TH is mounted, thethermistor TH is less likely to be influenced by heat generated by theLDO regulator 62. Accordingly, the thermistor TH can detect atemperature of the power supply 12 more accurately.

Since the charging IC 55 is mounted on the first surface 71 differentfrom the second surface 72 on which the thermistor TH is mounted, thethermistor TH is less likely to be influenced by heat generated by thecharging IC 55. Accordingly, the thermistor TH can detect a temperatureof the power supply 12 more accurately.

Both the first DC/DC converter 63 and the discharging terminal 41connected to the load 21 that functions by consuming power output by thefirst DC/DC converter 63 are mounted on the first portion 601 of thecircuit board 60. Both the second DC/DC converter 64 and the displaydriver 65 connected to the OLED panel 46 that functions by consumingpower output by the second DC/DC converter 64 are mounted on the secondportion 602 of the circuit board 60.

The discharging terminal 41 is not necessarily mounted on the firstportion 601 of the circuit board 60. For example, the dischargingterminal 41 may be mounted on a portion of the circuit board 60 otherthan the first portion 601 and connected to an element mounted on thefirst portion 601. Further, the display driver 65 is not necessarilymounted on the second portion 602 of the circuit board 60. For example,the display driver 65 may be mounted on a portion of the circuit board60 other than the second portion 602, and connected to an elementmounted on the second portion 602.

Accordingly, since the discharging terminal 41 is mounted on orconnected to the first portion 601 of the circuit board 60 and thedisplay driver 65 is mounted on or connected to the second portion 602of the circuit board 60, the discharging terminal 41 can be disposedclose to the first DC/DC converter 63 and the display driver 65 can bedisposed close to the second DC/DC converter 64. Therefore, it ispossible to shorten a path for supplying power stepped up by the firstDC/DC converter 63 to the load 21, and it is possible to shorten a pathfor supplying power stepped up by the second DC/DC converter 64 to theOLED panel 46. Accordingly, it is possible to reduce a loss of the powerstepped up by the first DC/DC converter 63 and the second DC/DCconverter 64. Then, it is possible to prevent an influence of the lossof the power stepped up by the first DC/DC converter 63 and the secondDC/DC converter 64 on other elements, and it is possible to prevent adecrease in an amount of an aerosol that can be generated by onecharging.

The first DC/DC converter 63 is mounted on the first surface 71, and thepower module 85 is mounted on the second surface 72. Accordingly, sincethe first DC/DC converter 63 and the power module 85 are mounted ondifferent surfaces of the circuit board 60, it is possible to preventconcentration of the heat generated by the first DC/DC converter 63 andheat generated by the power module 85 during power supply to the load21.

Since the power module 85 and the discharging terminal 41 are bothmounted on the first portion 721 of the second surface 72, the powermodule 85 and the discharging terminal 41 are mounted close to eachother. Accordingly, a length of a portion of the power supply line 60Fthat electrically connects the power module 85 and the dischargingterminal 41 can be shortened, and a power loss between the power module85 and the discharging terminal 41 can be reduced. Further, a pulsedcurrent flows through the portion of the power supply line 60F thatelectrically connects the power module 85 and the discharging terminal41. Therefore, by shortening the length of the portion of the powersupply line 60F that electrically connects the power module 85 and thedischarging terminal 41, it is possible to prevent an influence of thepulsed current on other elements.

No element is mounted in a region overlapping the thermistor TH mountedon the second surface 72 on the first surface 71 positioned on the backside of the second surface 72 when viewed from the left-right direction.

Therefore, the thermistor TH is less likely to be influenced by heatgenerated by the elements mounted on the first surface 71 positioned onthe back side of the second surface 72. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

The second surface 72 includes high-density regions 72A where a largenumber of elements are mounted and a mounting density of the mountedelements is high, and low-density regions 72B where a mounting densityof mounted elements is lower than those of the high-density regions 72A.In the present embodiment, the first portion 721, a region on an upperside of the coupling portion 720, and a region in the vicinity of acenter in the upper-lower direction of the coupling portion 720 betweenthe coupling portion 720 and the first portion 721 are the high-densityregions 72A. In the present embodiment, the thermistor TH is mounted inthe region on the rear side and the lower side of the coupling portion720 that is one of the low-density regions 72B where the mountingdensity of the mounted elements is lower than those of the high-densityregions 72A. In the present embodiment, in addition to the region on therear side and the lower side of the coupling portion 720, a region on alower side of the second portion 722, and a region on the rear side andan upper side of the second portion 722 are the low-density regions 72B.

Therefore, since the thermistor TH is mounted in the region where themounting density of the mounted elements is low, the thermistor TH isless likely to be influenced by heat generated by other elements mountedon the circuit board 60. Accordingly, the thermistor TH can detect atemperature of the power supply 12 more accurately.

As shown in FIG. 14, the ground line 60N is formed on the ground layer73 of the circuit board 60. In the present embodiment, the ground line60N is a conductive thin film formed on the ground layer 73 of thecircuit board 60, and has a reference potential of the circuit board 60.

The ground line 60N is not formed in a region overlapping the thermistorTH mounted on the second surface 72 when viewed from the left-rightdirection. Therefore, the thermistor TH is less likely to be influencedby heat generated by the ground line 60N. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

The ground line 60N is not formed in a region of a rear lower end of theground layer 73 including the region overlapping the thermistor THmounted on the second surface 72 when viewed from the left-rightdirection. In other words, the ground line 60N has a shape obtained bycutting out the region of the rear lower end of the ground layer 73 whenviewed from the left-right direction. Therefore, when viewed from theleft-right direction, the ground line 60N is not formed in the regionoverlapping the thermistor TH, and is formed so as not to surround thethermistor TH. Therefore, the thermistor TH is further less likely to beinfluenced by the heat generated by the ground line 60N. Accordingly,the thermistor TH can detect a temperature of the power supply 12 moreaccurately.

As shown in FIG. 15, a power supply path 743 for supplying power to theelements mounted on the circuit board 60 is formed on the power supplylayer 74 of the circuit board 60. The power supply path 743 isconfigured with the power supply lines 60A, 60B, 60C, 60D, 60E, 60G, andthe like. The power supply path 743 is a circuit wiring of a conductorformed on the power supply layer 74 of the circuit board 60 by printingor the like.

The power supply path 743 is not formed in the region overlapping thethermistor TH mounted on the second surface 72 when viewed from theleft-right direction. Therefore, the thermistor TH is less likely to beinfluenced by heat generated by the power supply path 743. Accordingly,the thermistor TH can detect a temperature of the power supply 12 moreaccurately.

The power supply path 743 is not formed in a region of a rear lower endof the power supply layer 74 including the region overlapping thethermistor TH mounted on the second surface 72 when viewed from theleft-right direction. Further, the power supply path 743 is formed so asnot to surround the thermistor TH when viewed from the left-rightdirection. Therefore, the thermistor TH is further less likely to beinfluenced by the heat generated by the power supply path 743.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

Accordingly, neither the ground line 60N of the ground layer 73 nor thepower supply path 743 of the power supply layer 74 is formed in theregion overlapping the thermistor TH mounted on the second surface 72when viewed from the left-right direction. Therefore, the thermistor THis less likely to be influenced by heat generated by both the groundline 60N and the power supply path 743. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

Returning to FIG. 2, the internal holder 13 holds the circuit board 60on a right side of the partition wall 13 d and holds the power supply 12on a left side of the partition wall 13 d. Accordingly, since both thecircuit board 60 and the power supply 12 are held by the internal holder13, the thermistor TH can be maintained at a position suitable fordetecting a temperature of the power supply 12.

The internal holder 13 may hold only a part of the circuit board 60 onthe right side of the partition wall 13 d and hold only a part of thepower supply 12 on the left side of the partition wall 13 d. Morespecifically, the internal holder 13 may hold the circuit board 60 andthe power supply 12 such that the position of the power supply 12 thatfaces the thermistor TH is exposed from the internal holder 13 in aleft-right direction of the thermistor TH. In this way, since atemperature of the power supply 12 is transmitted to the thermistor THwithout passing through the partition wall 13 d, the thermistor TH candetect the temperature of the power supply 12 more accurately and at ahigh speed.

As described above, in the present embodiment, among the power supplyconnector 81, the MCU 50, the charging IC 55, and the charging terminal43, the power supply connector 81, the MCU 50, and the charging IC 55are mounted on the first surface 71 of the circuit board 60, and thecharging terminal 43 is mounted on the second surface 72 of the circuitboard 60. Accordingly, the charging terminal 43 and the elements forcharging the power supply 12 are dispersedly mounted on both the firstsurface 71 and the second surface 72 of the circuit board 60, so thatheat generated by the charging terminal 43 and the elements whencharging the power supply 12 can be dispersed. The present invention isnot limited to the example described in the present embodiment. When thecharging terminal 43 and the elements for charging the power supply 12are separately mounted on both the first surface 71 and the secondsurface 72, the heat generated by the charging terminal 43 and theelements when charging the power supply 12 can be dispersed. That is,for example, among the power supply connector 81, the MCU 50, thecharging IC 55, and the charging terminal 43, the MCU 50 and thecharging IC 55 may be mounted on the first surface 71, and the powersupply connector 81 and the charging terminal 43 may be mounted on thesecond surface 72.

As described above, according to the power supply unit 10 of the presentembodiment, even when the power supply 12 of the power supply unit 10 ofthe aerosol inhaler 1 is in the over-discharged state, power from theexternal power supply can be supplied to the MCU 50 that is a controllerprovided in the power supply unit 10, and the power supply 12 can berecovered from the over-discharged state. Therefore, even when the powersupply 12 is in the over-discharged state, the power supply unit 10(that is, the aerosol inhaler 1) can be prevented from being unusable,and the user convenience can be improved.

The present invention is not limited to the above-described embodiment,and can be appropriately modified, improved, and the like.

At least the following matters are described in the present description.Corresponding components in the above embodiment are shown inparentheses. However, the present invention is not limited thereto.

(1) A power supply unit (the power supply unit 10) for an aerosolgeneration device (the aerosol inhaler 1) including:

a power supply (the power supply 12) configured to supply power to aheater (the load 21) configured to heat an aerosol source;

a receptacle (the charging terminal 43) configured to receive power forcharging the power supply from a plug connected to an external powersupply;

a charger (the charging IC 55) configured to control charging of thepower supply by power received by the receptacle; and

a controller (the MCU 50),

in which the receptacle and the power supply are connected in parallelwith the charger, and

in which the charger is configured to supply power from the receptacleand the power supply to the controller via the charger.

According to (1), the receptacle and the power supply are connected inparallel with the charger, and the power from the receptacle and thepower supply can be supplied to the controller via the charger.Therefore, even when the power supply is in an over-discharged state,power from the external power supply can be supplied to the controller.

(2) The power supply unit for the aerosol generation device according to(1), further including:

a protection IC (the protection IC 61) connected between the receptacleand the charger,

in which the power supply is connected between the protection IC and thecharger.

According to (2), since the power supply is connected between theprotection IC and the charger, the power supply can be discharged viathe charger without passing through the protection IC, and a power lossdue to passing through the protection IC can be reduced.

(3) The power supply unit for the aerosol generation device according to(1) or (2), further including:

a regulator (the LDO regulator 62) connected between the charger and thecontroller and including an activation terminal (the EN pin),

in which the regulator converts power supplied from the charger intopower that causes the controller to function in response to an input ofa high-level signal to the activation terminal, and

in which a positive electrode side further includes a capacitor (thecapacitor CD8) connected to the activation terminal and an output sideof the charger.

According to (3), the capacitor connected to the activation terminal ofthe regulator can be charged by the power from the charger, and thecharged capacitor can input the high-level signal to the activationterminal of the regulator. Accordingly, even when the regulator and thecontroller are in a stopped state due to power shortage of the powersupply, the regulator and the controller can be reactivated by the powerfrom the external power supply.

(4) The power supply unit for the aerosol generation device according toany one of (1) to (3),

in which the charger includes an output terminal configured to outputpower that is received by the receptacle and does not charge the powersupply and power supplied from the power supply in combination.

According to (4), since the charger can output the power that isreceived by the receptacle and does not charge the power supply and thepower supplied from the power supply in combination, it is possible touse a function of the power supply unit while preventing a decrease in aremaining capacity of the power supply when charging the power supply orconnecting the plug to the receptacle.

(5) The power supply unit for the aerosol generation device according toany one of (1) to (4), further including:

a load (the OLED panel 46, the LED 70) configured to function byconsuming supplied power,

in which the charger is configured to output power received by thereceptacle to the load and the power supply at the same time.

According to (5), since the charger can output the power received by thereceptacle to the load and the power supply at the same time, it ispossible to cause the load to function while charging the power supplywith the power from the external power supply.

(6) The power supply unit for the aerosol generation device according toany one of (1) to (5),

in which the controller is configured to perform control so as not tosupply power that is received by the receptacle and does not charge thepower supply to the heater.

According to (6), since the controller performs the control so as not tosupply the power that is received by the receptacle and does not chargethe power supply to the heater, the heater does not function whilecharging the power supply. Accordingly, it is possible to prevent anincrease in a temperature of the power supply due to an influence ofheat from the heater, and to prevent deterioration due to charging ofthe high-temperature power supply.

(7) The power supply unit for the aerosol generation device according to(6), further including:

a connector (the discharging terminal 41) connected to the heater; and

a case (the power supply unit case 11) configured to house the powersupply, the receptacle, the charger, the controller, the connector, andthe heater connected to the connector.

According to (7), since the case is provided in which the power supply,the receptacle, the charger, the controller, the connector, and theheater connected to the connector are collectively housed, userconvenience can be improved. Further, even when the case collectivelyhouses these components, it is possible to prevent the charging of thehigh-temperature power supply, so that safety can be improved inaddition to the convenience.

(8) The power supply unit for the aerosol generation device according to(6) or (7), further including:

a connector (the discharging terminal 41) connected to the heater; and

a DC/DC converter (the first DC/DC converter 63) connected between theconnector and the charger.

According to (8), since the DC/DC converter is provided between theconnector to which the heater is connected and the charger, power fromthe charger can be stepped up and supplied to the heater, and ageneration amount of an aerosol and a flavor can be improved. Further,since the DC/DC converter is an element that generates heat while thestepped-up power is supplied to the heater, the power supply can becharged without being influenced by the heat generation. Therefore, thesafety can be improved in addition to the generation amount of theaerosol and the flavor.

(9) The power supply unit for the aerosol generation device according toany one of (1) to (3),

in which the charger is configured to reactivate the controller in astopped state by power received by the receptacle when the power supplyis in an over-discharged state in which the power supply cannot supplypower for functioning the controller.

According to (9), even when the power supply is in the over-dischargedstate and the controller is in the stopped state, the controller (thatis, the power supply unit) can be reactivated by the power received bythe receptacle.

(10) The power supply unit for the aerosol generation device accordingto (9),

in which the charger does not supply power to the power supply in theover-discharged state until the controller is reactivated after theover-discharged state occurs.

According to (10), since the power is not supplied to the power supplyin the over-discharged state until the controller is reactivated, it ispossible to prevent inappropriate charging, to prevent deterioration ofthe power supply due to the inappropriate charging, and to safelyrecover the power supply in the over-discharged state.

(11) The power supply unit for the aerosol generation device accordingto (10),

in which the reactivated controller is configured to perform controlsuch that the charger intermittently supplies power to the power supplyin the over-discharged state.

According to (11), the power supply can be gradually charged, and thepower supply can be charged and recovered while preventing a burden onthe power supply (that is, the deterioration of the power supply).

(12) The power supply unit for the aerosol generation device accordingto (9),

in which the charger is configured not to supply power to the heateruntil the controller is reactivated.

According to (12), since the power is not supplied to the heater untilthe controller is reactivated, it is possible to prevent power frombeing supplied to the heater when the controller is not activated, andto prevent inappropriate heating or the like by the heater.

(13) The power supply unit for the aerosol generation device accordingto (12),

in which the reactivated controller is configured to perform control soas not to supply power to the heater until the over-discharged state isresolved.

In a case where the power supply is in the over-discharged state, whenthe plug connected to the external power supply is removed from thereceptacle, the controller is in a stopped state. Therefore, if power issupplied to the heater even when the over-discharged state of the powersupply is not resolved, a power supply to the heater cannot becontrolled at a moment when the plug is removed from the receptacle, andinappropriate heating or the like by the heater may occur. According to(13), since control is performed such that the power is not supplied tothe heater until the over-discharged state is resolved, it is possibleto prevent the inappropriate heating or the like by the heater asdescribed above and to recover from the over-discharged state moresafely. Further, it is possible to prevent generation of an aerosolhaving an unintended flavor due to the inappropriate heating or thelike.

(14) The power supply unit for the aerosol generation device accordingto any one of (1) to (13), further including:

a circuit board (the circuit board 60) including a first surface (thefirst surface 71) that faces the power supply and a second surface (thesecond surface 72) that is a back surface of the first surface or thatis positioned on a back side of the first surface and on which thecharger is mounted.

According to (14), since the charger is provided on the back surface ofthe first surface that faces the power supply or on the second surfacepositioned on the back side of the first surface, it is possible toprevent the power supply from being heated by heat of the charger and toprevent the deterioration of the power supply.

(15) The power supply unit for the aerosol generation device accordingto (14), further including:

a regulator (the LDO regulator 62) connected between the charger and thecontroller and configured to convert power supplied from the chargerinto power for causing the controller to function,

in which the regulator is mounted on the second surface (the secondsurface 72).

According to (15), since the regulator is provided on the secondsurface, it is possible to prevent the power supply from being heated byheat of the regulator and to prevent the deterioration of the powersupply.

What is claimed is:
 1. A power supply unit for an aerosol generationdevice comprising: a power supply configured to supply power to a heaterconfigured to heat an aerosol source; a receptacle configured to receivepower for charging the power supply from a plug connected to an externalpower supply; a charger configured to control charging of the powersupply by power received by the receptacle; and a controller configuredto control the charger, wherein the receptacle and the power supply areconnected in parallel with the charger, and wherein the charger isconfigured to supply power from the receptacle and the power supply tothe controller via the charger.
 2. The power supply unit for the aerosolgeneration device according to claim 1, further comprising: a protectionIC connected between the receptacle and the charger, wherein the powersupply is connected between the protection IC and the charger.
 3. Thepower supply unit for the aerosol generation device according to claim1, further comprising: a regulator connected between the charger and thecontroller and including an activation terminal, wherein the regulatorconverts power supplied from the charger into power that causes thecontroller to function in response to an input of a high-level signal tothe activation terminal, and wherein a positive electrode side furtherincludes a capacitor connected to the activation terminal and an outputside of the charger.
 4. The power supply unit for the aerosol generationdevice according to claim 1, wherein the charger includes an outputterminal configured to output power that is received by the receptacleand does not charge the power supply and power supplied from the powersupply in combination.
 5. The power supply unit for the aerosolgeneration device according to claim 1, further comprising: a loadconfigured to function by consuming supplied power, wherein the chargeris configured to output power received by the receptacle to the load andthe power supply at the same time.
 6. The power supply unit for theaerosol generation device according to claim 1, wherein the controlleris configured to perform control so as not to supply power that isreceived by the receptacle and does not charge the power supply to theheater.
 7. The power supply unit for the aerosol generation deviceaccording to claim 6, further comprising: a connector connected to theheater; and a case configured to house the power supply, the receptacle,the charger, the controller, the connector, and the heater connected tothe connector.
 8. The power supply unit for the aerosol generationdevice according to claim 6, further comprising: a connector connectedto the heater; and a DC/DC converter connected between the connector andthe charger.
 9. The power supply unit for the aerosol generation deviceaccording to claim 1, wherein the charger is configured to reactivatethe controller in a stopped state by power received by the receptaclewhen the power supply is in an over-discharged state in which the powersupply cannot supply power for functioning the controller.
 10. The powersupply unit for the aerosol generation device according to claim 9,wherein the charger does not supply power to the power supply in theover-discharged state until the controller is reactivated after theover-discharged state occurs.
 11. The power supply unit for the aerosolgeneration device according to claim 10, wherein the reactivatedcontroller is configured to perform control such that the chargerintermittently supplies power to the power supply in the over-dischargedstate.
 12. The power supply unit for the aerosol generation deviceaccording to claim 9, wherein the charger is configured not to supplypower to the heater until the controller is reactivated.
 13. The powersupply unit for the aerosol generation device according to claim 12,wherein the reactivated controller is configured to perform control soas not to supply power to the heater until the over-discharged state isresolved.
 14. The power supply unit for the aerosol generation deviceaccording to claim 1, further comprising: a circuit board including afirst surface that faces the power supply and a second surface that is aback surface of the first surface or that is positioned on a back sideof the first surface and on which the charger is mounted.
 15. The powersupply unit for the aerosol generation device according to claim 14,further comprising: a regulator connected between the charger and thecontroller and configured to convert power supplied from the chargerinto power for causing the controller to function, wherein the regulatoris mounted on the second surface.